SMT Threaded Standoff M1.6×0.35 2.00H Reliable

SMT threaded standoff M1.6×0.35 2.00H is a compact surface mount PCB hardware component designed for reliable mechanical spacing, fastening, and board-level support in electronic assemblies. Based on the drawing, this standoff features an internal M1.6×0.35 thread, 2.00 mm height, Ø3.66 mm outside diameter, and copper alloy construction with matte-tin plating for solderable SMT installation.

The product model is E6-07-048-2.0. This SMT threaded standoff is designed for surface mount solder pad assembly rather than through-hole terminal connection. The recommended land pattern shows a Ø4.26 mm suggested solder pad and a Ø2.53 mm non-plated through hole, helping support accurate PCB layout and stable mounting performance. The bottom diameter is Ø2.41 mm, and the base step height is 0.48 mm, while the drawing also specifies C0.2 chamfer details for the machined body edges.This SMT threaded standoff M1.6×0.35 2.00H uses copper alloy material with matte-tin plating, making it suitable for solder attachment to PCB pads. The operating temperature range is -55°C to +150°C, supporting use in demanding electronic environments where mechanical support, grounding structure, shielding fixation, module mounting, or board stacking may be required.With RoHS compliance, compact vertical design, solder pad mounting, and internal thread construction, this SMT standoff is suitable for PCB hardware applications in communication equipment, industrial electronics, embedded modules, consumer electronics, control boards, and compact device assemblies that require dependable threaded mounting support.