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4-pin USB Type-C design supporting USB 3.1 Gen 2 and PD functions
Mid-mount structure ensures compact PCB profile
SMT compatible with standard reflow soldering
Gold-plated contact areas for better conductivity and durability
High insertion and extraction life cycle (10,000+ times)
Introducing the USB 3.1 Type-C 24-pin receptacle connector, designed for high-speed data transmission and efficient power delivery in PCB-mounted devices. With its SMT vertical mid-mount style, this connector is engineered to seamlessly elevate the connectivity of your electronics, ensuring that performance meets practicality.
This 4-pin USB Type-C connector supports USB 3.1 Gen 2 and Power Delivery (PD) functions, providing a versatile solution for all your high-speed data needs. The mid-mount structure guarantees a compact PCB profile, facilitating easy integration into a variety of devices without compromising space. Its surface-mount technology is compatible with standard reflow soldering processes, simplifying the assembly of your electronic products.
Crafted for longevity, the USB 3.1 Type-C connector boasts gold-plated contact areas that enhance conductivity and durability, ensuring consistent performance over time. With a life cycle rated for high insertion and extraction (up to 10,000 times), this connector stands resilient against daily wear and tear. The shell and shielding plate, made from stainless steel and nickel-plated for corrosion resistance, enhance the durability further.
The contacts are made from a copper alloy, available in various gold plating options including Flash Gold and multiple thicknesses ranging from 3µ to 30µ. This customization ensures that you can choose the variant that best fits your application needs. Housed in high-temperature black LCP (UL94V-0), this connector meets rigorous safety and performance standards.
Ideal for a wide range of applications, the USB 3.1 Type-C 24-pin receptacle connector is perfectly suited for laptops, smartphones, tablets, chargers, hubs, docking stations, automotive infotainment systems, consumer electronics, and industrial control systems. Furthermore, it complies with EU RoHS, REACH SVHC, and low-halogen requirements, making it a responsible choice for environmentally-conscious manufacturers.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MUB-CF024168-XXTR-01 | Description | USB Type-C Receptacle, 24PIN, SMT Type, Mid-Mount, Height 7.90mm |
| Application | Wire-to-Board /Cable-to-Board | Comments | RoHS Compliant |
| Component Type | Receptacle | Product Name | USB Type-C |
| USB Version | USB Type-C Gen 2 / USB 3.1 | Type | Type-C |
| Keywords | USB Type-C Receptacle, USB 3.1, USB-C connector, USB Type-C Connector, TYPE C connector, USB Type-C Gen 2, I/O Connector, SMT Type | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 3.0A Max | Grounding to Panel | Yes |
| Shielded | Yes | Shield Type | Stainless Steel, Full Shield |
| Voltage – Maximum | 30V AC | Contact Resistance | ≤40mΩ Max |
| Insulation Resistance | ≥100MΩ | Dielectric Withstanding Voltage | 100V AC for 1 Minute |
| 3. Physical | |||
| Circuits (Loaded) | 24 | Circuits (Maximum) | 24P |
| Color – Housing | Black | Durability (Mating Cycles Max) | 10,000 Cycles |
| Keying to Mating Part | Yes | Gender | Female / Receptacle |
| Material – Contact | Copper Alloy, Gold Plated | Plating on soldering area | Gold |
| Material – Housing | High Temp Plastic UL94V-0 | Connector Mounting Type | SMT |
| Mounting Style | Mid-Mount SMT | Net Weight | – |
| Packaging Type | Tape & Reel | Orientation | Right Angle |
| PCB Retention | Yes | Vacuum Pick-up Cap | – |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -30°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 4 |
| Pitch – Termination Interface | 0.50 mm | Ports | 1 |
| Termination Interface Style | Right Angle | PCB Thickness (Recommended) | 0.8mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
| Weight | 1 kg |
|---|---|
| Dimensions | 12 × 9 × 2 cm |
| TEST | A4444, B84444, A94444, B94444 |
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