1.25mm Right-Angle SMT Wire-to-Board Connector (Wafer Header)
1.25mm Right-Angle SMT Wire-to-Board Connector from Dragon Well is a fine-pitch, single-row wafer header designed to mate with crimp housings. The series uses SMT gull-wing terminals plus a solder nail / hold-down for extra board retention, and supports side-lock compatibility for 2-circuit and 3-circuit latch styles (see lock configuration on the drawing). A recommended PCB layout is provided with 1.25 ± 0.10 mm pad pitch and end hold-downs. The product is RoHS compliant and supplied in Tape & Reel.
Why choose this wafer header
This 1.25mm Right-Angle SMT Wire-to-Board Connector balances compact size with robust assembly. Tin-plated over nickel terminals (brass base) provide consistent solderability, while the LCP UL 94V-0 housing tolerates reflow and everyday thermal cycles. Multiple circuit counts are available (see the A/B/C/D dimension table on the drawing), so overall length scales with number of positions. For a quick overview of our capabilities, visit About / Capabilities.
Drawing-derived specifications (no guesses)
- Pitch / Row: 1.25 mm, single row; circuit counts as listed in the dimension table.
- Orientation / Mounting: Right-angle (90°), SMT gull-wing leads with solder nail / hold-down.
- Electrical ratings: 1.0 A AC/DC, 125 V AC/DC; ≤ 20 mΩ contact resistance; ≥ 100 MΩ insulation resistance; dielectric withstand 250 V AC / minute.
- Operating temperature: −25 °C to +85 °C.
- Materials: contacts & solder nail: brass; insulator: LCP, UL 94V-0.
- Plating: tin plated over nickel (series also offers optional gold on contact area per code: Gold Flash / 3 µin / 6 µin / 15 µin / 30 µin).
- Compliance: RoHS. (REACH SVHC / Low-Halogen on request.)
- Recommended PCB layout: 1.25 ± 0.10 mm pad pitch, end hold-downs per drawing.
- Packaging: Tape & Reel.
PCB layout & footprint notes
The fine-pitch footprint is optimized for stencil print and automated placement. Keep paste volumes consistent on the gull-wing pads and on the hold-down anchors to balance wetting and shear strength. Follow the drawing’s DIM A/B/C/D scaling for overall length as the pin count increases.
Applications & fit
Ideal for consumer electronics, LED light bars, small appliances, industrial control modules, and IoT devices—any design that needs a compact 1.25mm wire-to-board interface with a right-angle exit. If your design needs the mating receptacle, see our 1.25 mm crimp housing / wafer receptacle options.
Design notes & selection guide
The 1.25mm Right-Angle SMT Wire-to-Board Connector is a good fit when you need a low-profile harness exit off the board edge. The right-angle orientation keeps cable strain away from sensitive components and helps you route in tight enclosures. Choose the circuit count that matches your I/O lines; overall length scales with the DIM A/B/C/D values on the drawing. If your application sees frequent mate/unmate cycles, consider one of the series’ gold options (Gold Flash / 3 µin / 6 µin / 15 µin / 30 µin) to balance cost and contact life. For general connector families, browse our Wire-to-Board options.
Assembly & reflow recommendations
For consistent joints at this fine pitch, keep stencil alignment tight and verify paste volume on both the gull-wing pads and the solder nail / hold-down anchors. During reflow profiling, ensure peak and soak windows comply with your solder paste supplier’s guidance and that the LCP housing remains within recommended temperature exposure. After reflow, check for proper heel/toe fillets on the outer leads, even wetting on the anchors, and verify the connector sits flat without lift. If touch-up is needed, use brief, localized heat to avoid stressing adjacent plastic features.
Harness & mating tips
This header is designed to mate with 1.25 mm crimp housings using side-lock latches. Confirm that your housing keying and latch style match the lock configuration shown on the drawing (2-circuit and 3-circuit examples are illustrated). Maintain correct wire strip length for your crimp contacts and avoid over-tinning, which can increase insertion force. If you need a compatible receptacle, explore our 1.25 mm crimp housing / wafer receptacle search results.
Quality & compliance
The series is listed as RoHS compliant on the drawing. REACH SVHC and low-halogen declarations are available upon request. For programs that require document control, include the full part number with plating code (DW-WF-112530WRnP-XXTR-01) on your PO so QA can match certificates and packaging labels.
Conclusion
Need a compact, reliable interconnect? This 1.25mm Right-Angle SMT Wire-to-Board Connector delivers a fine-pitch footprint, strong board retention via the solder nail, and flexible plating options. For quotes or samples, reach our team via Contact / RFQ.
Ordering information
Series / model: DW-WF-112530WRnP-XXTR-01 (1.25 mm pitch, right-angle SMT wafer). “XX” designates plating options (e.g., Gold Flash / 3 µin / 6 µin / 15 µin / 30 µin; standard tin-over-nickel). Packaging code TR = Tape & Reel. For an RFQ, contact our team via Contact / RFQ.
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