$0.08
3.5mm Audio Jack – Pro-Grade Right-Angle SMT, Edge-Mount for board-edge mounting. Integrated changeover enables jack-detect/mute; 12 VAC, 1 A, 500 VAC withstand, ≥5,000 cycles, −30~+80 °C. Robust footprint with locator slots for secure retention.
Key Features at a Glance:
Right-angle SMT, edge-mount footprint with locator slots R0.65
Integrated normally-closed switch for detect/mute control
Compact outline: 8.50 mm width, ~12.00 mm depth, ~9–10 mm height
Electrical: 12 VAC, 1 A, ≤50/≤100 mΩ contact (init/after life), ≥100/≥50 MΩ insulation (init/after humidity), 500 VAC withstand
Mechanical: ≤3.0 kgf mate, ≥0.3 kgf un-mate, ≥5,000 cycles
UL94V-0 housing; gold-flash over Ni on contacts; RoHS compliant
Highlights:
Edge-aligned, low-profile audio jack; switch simplifies system detect/mute; stable SMT retention with mechanical holes; proven durability for consumer and industrial designs.
Applications:
Portable audio devices • Laptops/tablets • Set-top boxes • Intercoms • Industrial HMI audio • Test instruments and docks.
3.5mm audio jack is a right-angle, edge-mount receptacle for compact audio I/O. The SMT design uses a robust footprint with locator slots (R0.65) and alignment to the PCB edge; pads are paired with mechanical holes for retention under cable pull.
| 1. General | |||
| Status | Active | Category | Audio/Phono Jack |
| Model No. | DW-PJ-S38165A | Description | 3.5mm Phone Jack Connector |
| Component Type | Receptacle | Product Name | Phone Jack CONN |
| 2. Electrical | |||
| Current – Maximum per Contact | 1 AMP | Voltage – Maximum | 12 VAC RMS |
| Shielded | _ | Grounding to Panel | _ |
| Contact Resistance (Max) | 50 mΩ (initial), 100 mΩ (after life) | Insulation Resistance (Min) | 100 MΩ @ 500 VDC (initial); 50 MΩ @ 500 VDC (after humidity) |
| Withstand Voltage | 500 VAC RMS, 50/60 Hz, 1 minute | ||
| 3.Physical | |||
| Circuits (Loaded) | 6 (Terminals 1–6) | Circuits (Maximum) | 6 |
| Gender | Female | Orientation | Right Angle |
| Termination Interface Style | SMT (ALL SMT TAIL) | Ports | 1 |
| Material – Contact | Copper Alloy | Material – Resin / Housing | High Temp, Black |
| Material – Plating Mating | GF (Gold Flash) | Material – Plating Termination | AG |
| Overall Underplating | Ni 40 µ” (overall) | Waterproof / Dustproof _ | |
| Panel Mount | _ | PCB Thickness – Recommended | |
| PCB Locator | _ | Packaging Type | _ |
| Polarized to Mating Part | _ | Polarized to PCB | _ |
| Pitch – Mating Interface | _ | Wire Size (AWG) | _ |
| Net Weight | _ | Number of Rows | _ |
| 4.Mechanical | |||
| Mating Force (Max) | 3.0 kgf | Operating Temperature | −30 °C to +80 °C |
| Operating Life (Cycles) | ≥ 5000 | Unmating Force (Min) | 0.3 kgf |
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