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Built for tough assemblies, the USB 3.0 Type-A female connector uses a right-angle DIP pin field plus four shell stakes and locating pegs for rock-solid placement before solder. Gold-plated contacts and a nickel-plated shell deliver stable low resistance for 5 Gb/s SuperSpeed links, while the UL94V-0 PBT housing withstands rework and heat. With AC 100 V dielectric hold-off, ≥100 MΩ insulation, and ≥8k–10k mating life, it’s a dependable I/O port for PCs, hubs, industrial control cards, and communication gear.
Key Features at a Glance
• USB 3.0 Type-A, right-angle 180° DIP through-hole
• Locating pegs + 4 shell solder legs for secure retention
• SuperSpeed 5 Gb/s signal set (VBUS, D±, SSTX±, SSRX±, GND)
• Dielectric withstand AC 100 V; insulation ≥100 MΩ
• Contact resistance ≤30–50 mΩ; durability ≥8k–10k cycles
• Housing PBT UL94V-0 (blue); Au-plated contacts, Ni-plated shell
• Operating −55 °C to +85 °C; RoHS/REACH compliant
Highlights
• Wave-solder friendly design with pegs
• strong shell staking
• gold-on-mating contacts for long-life SuperSpeed performance.
Applications
• Desktop/mainboards
• USB hubs
• Industrial controllers
• Multimedia/AV systems
• Communication equipment.
USB 3.0 Type-A female connector for high-reliability board I/O where a through-hole jack and firm panel alignment are required. This right-angle 180° DIP receptacle uses a robust housing and four solderable shell legs plus locating pegs to lock the part to the PCB during wave solder.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MU3-DA9050-09TP-01 | Description | USB 3.0 Type-A Female, 9PIN, 180° Straight DIP, , Long Body with Housing Sleeve & Pegs |
| Application | wire to board /Cable-to-Board | Comments | Extended body, through-hole with locking posts |
| Component Type | Receptacle | Product Name | USB Type-A |
| USB Version | USB 3.0 | Type | Type-A |
| Keywords | USB A Connector, USB 3.0 Connector, Straight Type USB, USB DIP Connector, Panel Mount USB, USB Female Socket, Type-A USB Port | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.8A (VBUS & GND) / 0.25A (others) | Grounding to Panel | Yes (via shell legs) |
| Shielded | Yes | Shield Type | Full Shield with Panel Lock Tabs |
| Voltage – Maximum | 20V DC | Contact Resistance | 30mΩ Max (VBUS/GND), 50mΩ Max (others) |
| Insulation Resistance | 100MΩ Min | Dielectric Withstanding Voltage | 100V AC |
| 3. Physical | |||
| Circuits (Loaded) | 9 | Circuits (Maximum) | 9PIN |
| Color – Housing | Blue | Durability (Mating Cycles Max) | 1,500 Cycles |
| Flammability | PBT UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | Yes |
| Material – Contact | Copper Alloy (T=0.25mm) | Plating on soldering area | Tin Plated |
| Plating on contact area | Gold Plated | Material – Housing | PBT Blue UL94V-0 |
| Mounting Style | DIP (Through-Hole) | Connector Mounting Type | Board Mount with Pegs |
| Number of Rows | 2 (Main row + shell tabs) | Net Weight | – |
| Packaging Type | Tray Packing | Orientation | Straight / 180° |
| PCB Retention | Yes (Dual pegs) | Vacuum Pick-up Cap | No |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -55°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 4 pegs + shield tabs |
| Pitch – Termination Interface | 2.50 mm | Ports | 1 |
| Termination Interface Style | VERTICAL | PCB Thickness (Recommended) | 1.6 mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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