$0.11
0.5mm Back-Flip FPC Connector – Ultra-Low-Profile ZIF, Right-Angle SMT, 1.0mm mated height, Au-plated contacts, and tape-and-reel packaging; 50 V, 0.4 A, ≤30 mΩ, ≥1000 MΩ, 500 V AC withstand; footprints from 4–45 pins.
Key Features at a Glance:
Back-flip ZIF latch for low insertion force and secure retention
Right-angle SMT, 1.0 mm mated height for ultra-slim designs
0.50 mm fine pitch; precise land pattern (0.30 × 0.80 mm pads)
Pin counts 4–45 with shared footprint family
Contact finishes: Gold Flash / 3 / 6 / 15 / 30 µin Au (Ni underplate)
Electrical: 50 V, 0.4 A, ≤30 mΩ, ≥1000 MΩ, 500 V AC/1 min
Temperature: −55~+85 °C; RoHS/REACH compliant; TR = Tape & Reel
Highlights:
Ultra-low profile, robust cable retention, reflow-capable housing, and scalable pin counts cut BOM risk while maximizing board space in portable and industrial electronics.
Applications:
Smartphones and tablets • Cameras and displays • Wearables • Automotive modules • Medical/industrial instruments • IoT control boards requiring thin, serviceable FPC links.
0.5mm back-flip FPC connector for compact PCB-to-flex interconnects where low insertion force and minimal stack height are critical. This right-angle, surface-mount ZIF socket uses a rear-hinged actuator that closes behind the cable to lock it securely with gentle insertion pressure ideal for automated assembly and service access. The mated height is just 1.0 mm, enabling dense layouts in handhelds, wearables, and slim modules.
| 1. General | ||||
| Field | Value | Field | Value | |
| Status | Active | Category | FFC / FPC Connectors | |
| Series | DW-FPC-S051008P-01TR-01 | Description | 0.5 mm Pitch FPC Connector, Back-Flip Actuator, SMT (right-angle) | |
| 2. Electrical | ||||
| Current – Maximum per Contact | 0.4 A | Voltage – Maximum | 50 V AC/DC | |
| Withstand Voltage | 500 V AC / minute | Contact Resistance | ≤ 30 mΩ (Max.) | |
| Insulation Resistance | ≥ 100 MΩ (Min.) | Temperature Range – Operating | −55 °C to +85 °C | |
| 3. Physical | ||||
| Actuator Type | Back-Flip | Circuits (Loaded) | 4P–50P (see table) | |
| Color – Resin | _ | Contact Position | (back-flip type) | |
| Durability (Mating Cycles) | Not specified | Mated Height | 1.0 mm | |
| Material – Metal | Copper alloy | Material – Plating Mating | Au over Ni (01/03/06/15/30 µin options) | |
| Material – Plating Termination | 31: Sn / 32: Ni | Material – Resin | Not specified (UL94V-0 not listed) | |
| Net Weight | Not specified | Orientation | Right-angle / Horizontal | |
| Packaging Type | Tape & Reel (TR) | PCB Locator | _ | |
| PCB Mounting | Surface-Mount (SMT) | PCB Retention | _ | |
| Pitch – Mating Interface | 0.5 mm | Polarized to PCB | Yes | |
| Stackable | _ | Temperature Range – Operating | −55 °C to +85 °C | |
| Cable Compatibility | FFC/FPC thickness 0.1–0.3 mm | Notes | RoHS compliant | |
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