SATA 22P Right Angle SMT Receptacle 1.27 mm (7 signal + 15 power) designed for storage interfaces on compact boards. It features a right-angle, top-mount SMT configuration with segregated signal and power sections on 1.27 mm pitch. The recommended PCB layout shows pad rows for the 7-pin and 15-pin groups with keep-outs for the plastic pegs.
Highlights : 22-pin SATA (7+15) in a right-angle SMT form factor
Fine-pitch (1.27 mm) signal & power groups for dense layouts
Gold-over-Ni contacts with matte-tin tails for reliable soldering
Wide –40°C to +105°C operating range; reflow-ready construction
Application : HDD/SSD backplanes, SBCs, storage adapters, DVR/NVR, servers, industrial PCs.
SATA 22P Right Angle SMT Receptacle 1.27 mm DW-SAT-S22501 is a compact board-mount socket for 22-pin SATA storage (7 signal + 15 power).
| General | |||
| Product Type | SATA Receptacle | Interface Type | SATA 7+15P (22P) |
| Positions (Contacts) | 22 | Pitch (mm) | 1.27 / 0.90 (per PCB layout) |
| Mounting Type | SMT, straddle-mount | Orientation | Vertical |
| Connector System | Cable-to-Board | Mating Direction | Perpendicular to PCB (vertical) |
| Number of Rows | 1 | Number of Ports | 1 |
| Model No. | DW-SAT-S22501-XXTP-01 | Status | Active |
| RoHS | Compliant | REACH | — |
| UL Flammability | UL94 V-0 | ||
| Physical | |||
| Housing/Insulator Material | LCP, 30% G/F, UL94 V-0 | Color | Black |
| Contact Base Material | Copper alloy | Contact Plating (Mating Area) | Gold, per order code (01/03/06/15/30 µin) |
| Underplate | Nickel ≥ 50 µin | Tail Plating | Matte Tin ≥ 100 µin |
| Recommended PCB Thickness | 1.2 mm | Retention/Board Lock | Solder peg(s), length 3.28 ± 0.20 mm |
| Overall Length | 42.85 mm | Other Dimensions | See drawing |
| Electrical | |||
| Voltage Rating (V) | — | Current Rating (A per contact) | 1.5 |
| Contact Resistance (mΩ max) | — | Insulation Resistance (MΩ min) | 1000 |
| Dielectric Withstanding Voltage | AC 500 V | Operating Temperature (°C) | −40 ~ +105 |
| Solder Process Data | |||
| Lead-Free Process Capability | Reflow | Peak Temp (°C) | 230 °C for 30–60 s; 260 °C for 10 s |
| Time at Peak (s) | 30–60 / 10 | Preheat (°C / s) | — |
| Reflow Cycles (Max) | — | Termination to PCB | SMT |
| Packaging | |||
| Packaging Method | TP (Tray Packing) | Alternative Options | TR (Tape Reel) / TB (Tube) |
| Series / Plating Code | – |
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