$0.13
1.27 mm Dual-Row SMT Pin Header, Vertical, Base 1.0 mm It features a vertical (top-entry) orientation with surface-mount terminals and a 1.0mm standoff/base for solder-paste clearance. The series supports per-row pin counts from 2 to 50 (total ways 4–100) with overall lengths DIM A / DIM B varying by pin count (see table on the drawing).
Applications: Industrial controllers, communication modules, embedded boards, consumer electronics, IoT gateways.
Highlights: Fine-pitch 1.27 mm dual-row; vertical SMT with 1.0 mm standoff for clean reflow; SQ 0.40 mm posts; Au plating options (flash–30 µin); wide pin range 2×2 to 2×50; −40~+105 °C; RoHS; tape-
1.27 mm Dual-Row SMT Pin Header, Vertical, Base 1.0 mm is a fine-pitch, vertical (top-entry) header for compact board-to-board or board-to-cable links where density and reflow quality matter.
| General | |||
| Status | Active | Category | PCB Header |
| Series | DW-PH-2127298WVnP-XXTR-01 | Description | 1.27 mm Pin Header, Dual Row, SMT Type (Base 1.00H) |
| Application | Board-to-board / board-to-cable headers | Component Type | PCB Header |
| Product Name | 1.27 PIN HEADER DUAL ROW SMT TYPE BASE 1.00H | UPC | — |
| Electrical | |||
| Current – Maximum per Contact | 1:00 AM | Voltage – Maximum | AC 500 V |
| Contact Resistance | 20 mΩ Max. | Insulation Resistance | 1000 MΩ Min. |
| Physical | |||
| Circuits (Loaded) | Configurable (even pin counts) | Circuits (Maximum) | 100 (2×50) |
| Color – Resin | Black | Flammability | UL94V-0 |
| Glow-Wire Capable | — | Lock to Mating Part | N/A |
| Material – Metal | Brass | Material – Plating Mating | Au 0.5–0.8 µin over Ni 30–50 µin |
| Material – Plating Termination | Sn / Ni options (per code 31 / 32) | Material – Resin | PA6T + 30% GF |
| Net Weight | — | Number of Rows | Dual Row |
| Orientation | Vertical | Packaging Type | Tape Reel (TR) |
| PCB Locator | None shown | PCB Retention | SMT solder tails (no pegs) |
| PC Tail Length | 3.05 ± 0.50 mm | Pitch – Mating Interface | 1.27 mm |
| Plating min – Mating | 0.5 µin Au | min | Plating min – Termination |
| Polarized to PCB | No | Temperature Range – Operating | −40 °C to +105 °C |
| Termination Interface Style | SMT | ||
| Solder Process Data | |||
| Max-Duration | 10 s (resistance to soldering heat) | Lead-Free Process Capability | Reflow, Pb-free |
| Max-Cycle | — | Max-Temp | 260 °C ±5 °C |
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