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Designed for slim enclosures, the Micro USB 5-pin female connector uses a mid-mount SMT body to cut z-height while maintaining a strong, front-frame shell. A 0.65 mm pitch and reinforced, laser-welded shield provide stable joints through repeated insertions. Rated 1.8 A (VBUS) and 1 A on data pins with 100 VAC dielectric holdoff, it delivers dependable USB 2.0 charging and sync from −30 °C to +80 °C. The compact 5.9 mm profile and board-edge geometry make it a clean drop-in for wearables, handhelds, and portable accessories.
Key Features at a Glance
Mid-mount Micro-B receptacle; 5.9 mm low profile
SMT contacts, 0.65 mm pitch; reinforced shell with laser welding
Electrical: 1.8 A (pin 1), 1.0 A (pins 2–4), 100 VAC/1 min withstand
Contact ≤50 mΩ; insulation ≥100 MΩ
Mating force ≤3.57 kgf; unmating ≥1.0 kgf
RoHS/REACH compliant; tape-and-reel packaging
Highlights
Ultra-slim mid-mount profile, robust shell retention, stable low-resistance contacts, and easy reflow assembly for high-volume builds.
Applications
Smartphones • Handheld devices • MP3 players • GPS units • Wearables • Power banks • Compact consumer electronics.
Micro USB 5-pin female connector for compact devices that need a low-profile, mid-mount USB 2.0 port with robust board retention. This right-angle receptacle sits 5.9 mm high and solders directly to the PCB in a mid-mount configuration to minimize z-height while keeping the shell flush to the bezel.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | MNB-0008S00-051-142 | Description | Micro USB 5P Receptacle, SMT Type, Recessed Mid-Mount, L=5.9mm, H=3.5mm |
| Application | Wire-to-Board /Cable-to-Board | Comments | RoHS Compliant |
| Component Type | Receptacle | Product Name | Micro USB |
| USB Version | USB 2.0 | Type | Type-B |
| Keywords | Micro USB, USB 2.0, USB TYPE, I/O Connector, Recessed Mid-Mount, Sealed Connector, compact board-edge usb connector | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.8A (Pin 1-5), 1A (Pin 2/3/4) | Grounding to Panel | Yes |
| Shielded | Yes | Shield Type | Copper Alloy Shield |
| Voltage – Maximum | 30V AC (RMS) | Contact Resistance | ≤50mΩ Max |
| Insulation Resistance | ≥100MΩ @ 100V AC | Dielectric Withstanding Voltage | 100V AC for 1 Minute |
| 3. Physical | |||
| Circuits (Loaded) | 5 | Circuits (Maximum) | 5P |
| Color – Housing | Black | Durability (Mating Cycles Max) | – |
| Keying to Mating Part | Yes | Gender | Female / Receptacle |
| Material – Contact | Copper Alloy, Gold Plated | Plating on soldering area | Gold Plated |
| Material – Housing | LCP UL94V-0 | Connector Mounting Type | SMT |
| Mounting Style | Recessed Mid-Mount | Net Weight | – |
| Packaging Type | Tray | Orientation | Right Angle |
| PCB Retention | Yes | Vacuum Pick-up Cap | – |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -30°C to +80°C |
| Waterproof / Dustproof | No | Number of Mount legs | 2 |
| Pitch – Termination Interface | 0.65 mm | Ports | 1 |
| Termination Interface Style | Right Angle | PCB Thickness (Recommended) | 0.8mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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