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The Micro USB B 5-pin female connector pairs fine-pitch SMT leads with through-hole shell stakes to create a compact jack that stands up to daily cable stress. A 7.2 mm body eases bezel fit, while the nickel-plated shield and gold-finished contacts maintain low resistance through 10k insertions. Rated 1 A / 30 V with 100 VAC dielectric hold-off, the hybrid footprint simplifies routing and delivers strong solder joints on high-density PCBs. It’s a dependable drop-in for rechargeable wearables, handheld electronics, GPS accessories, and portable medical tools requiring a rugged Micro-B power/data port.
Key Features at a Glance
Hybrid SMD + DIP Micro-B receptacle; 0.65 mm pitch
Compact 7.2 mm front width; reinforced shell ground tabs
Electrical: 1.0 A, 30 V, 100 VAC/1 min withstand
Contact resistance: ≤30 mΩ initial, ≤40 mΩ after life; ≥10,000 cycles
Typical forces: ≤35 N mate; ≥10 N un-mate (initial)
Materials: UL94V-0 LCP housing; Au-over-Ni contacts; nickel-plated metal shell
Operating −30~+80 °C; RoHS/REACH; TR = Tape & Reel
Highlights
Rugged board anchoring from SMT + posts; stable low-resistance contacts; compact outline suited to slim handheld designs.
Applications
Smartphones & tablets • Wearables • Handheld GPS • Digital cameras • Power banks & portable chargers • Compact consumer & medical devices.
Micro USB B 5-pin female connector for compact board-edge I/O where robust retention and proven Micro-B compatibility are essential. This right-angle receptacle uses a hybrid SMD + DIP structure: 0.65 mm-pitch SMT leads handle the signals while large through-hole shell stakes and ground tabs secure the connector to the PCB and resist cable peel.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | MNB-0010S00-061-132-05TR-01 | Description | Micro USB AB Receptacle, 5PIN, SMT + DIP Type, Hybrid Mount, Height 3.05mm |
| Application | Wire-to-Board /Cable-to-Board | Comments | RoHS Compliant |
| Component Type | Receptacle | Product Name | Micro USB |
| USB Version | USB 2.0 | Type | AB-Type |
| Keywords | Micro USB, USB 2.0, USB TYPE, I/O Connector, Hybrid Mount, Sealed Connector | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.0A | Grounding to Panel | Yes |
| Shielded | Yes | Shield Type | Nickel Plated Shield |
| Voltage – Maximum | 30V DC | Contact Resistance | ≤30mΩ Initial, ≤40mΩ After 10K Cycles |
| Insulation Resistance | ≥100MΩ @ 100V AC | Dielectric Withstanding Voltage | 100V AC for 1 Minute |
| 3. Physical | |||
| Circuits (Loaded) | 5 | Circuits (Maximum) | 5P |
| Color – Housing | Black | Durability (Mating Cycles Max) | 10,000 Cycles |
| Keying to Mating Part | Yes | Gender | Female / Receptacle |
| Material – Contact | Copper Alloy, Gold Plated | Plating on soldering area | Gold Flash to 30μ” Au |
| Material – Housing | High Temp Thermoplastic | Connector Mounting Type | SMT + DIP |
| Mounting Style | Hybrid Mount | Net Weight | – |
| Packaging Type | Tape & Reel | Orientation | Right Angle |
| PCB Retention | Yes | Vacuum Pick-up Cap | – |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -30°C to +80°C |
| Waterproof / Dustproof | No | Number of Mount legs | 4 |
| Pitch – Termination Interface | 0.65 mm | Ports | 1 |
| Termination Interface Style | Right Angle | PCB Thickness (Recommended) | 0.8mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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