$0.08
Micro USB Type B Receptacle – Durable Right-Angle SMT, 5-Pin, Hybrid Shield Stakes 0.65 mm pitch, 1.8 A on VBUS/GND, 100 VAC withstand, ≤30 mΩ contact resistance, ≥100 MΩ insulation; compact ~5.15 mm height; tape-and-reel.
Key Features at a Glance:
Right-angle, top-mount Micro USB Type B, 5-pin
0.65 mm SMT pads + Ø1.50 mm THT shield posts
Compact outline: ~7.40 × 5.10 × 5.15 mm (W×D×H)
Standard pinout with ID for OT
Electrical: 1.8 A (VBUS/GND), 1.0 A (D±/ID), 100 VAC/1 min, ≤30 mΩ, ≥100 MΩ
Materials: UL94V-0 housing, Au-over-Ni contacts, SUS304 shield
Tape-and-reel packaging; RoHS/REACH compliant
Highlights:
Hybrid SMT+THT anchoring for rugged cable retention; proven Micro USB ecosystem compatibility; low profile for dense front-panel designs; multiple gold options via plating code.
Applications:
Smartphones and accessories • Handheld instruments • Wearables • Chargers and gateways • IoT/embedded boards needing compact USB power/data/OTG.
Micro USB Type B receptacle for compact board-edge I/O where a robust attachment and clean signal integrity are required. This right-angle, top-mount connector combines SMT signal pads on 0.65 mm pitch with two through-hole shield stakes and large anchor pads for high peel-off strength during cable pulls.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MCB-CB5210-01TR-01 | Description | Micro USB Type-B Receptacle, Right Angle, SMT Contacts + Through-Hole Shell, 5 Pin, Shielded |
| Application | Board-mount USB device receptacle | Comments | Contact plating options: 01 / 03 / 05 / 15 / 30 µin Au on mating area; TR = Tape Reel |
| Component Type | Receptacle | Product Name | Micro USB Type-B |
| USB Version | USB 2.0 (implied by D+/D−, 5-pin) | Type | Micro-B |
| Keywords | USB Micro-B, Right Angle, SMT, Through-Hole, Shielded | Circuit Application | VBUS / D− / D+ / ID / GND (per pin table) |
| 2. Electrical | |||
| Current – Maximum | 1 & 5 PIN: 1.8 A Max; 2/3/4 PIN: 1.0 A Max | Grounding to Panel | _ |
| Shielded | Yes | Shield Type | Stainless steel (SUS304) shield, matte Ni plated overall |
| Voltage – Maximum | Dielectric Withstand: 100 V AC for 1 min | Contact Resistance | 30 mΩ Max |
| Insulation Resistance | 100 MΩ Min | Dielectric Withstanding Voltage | 100 V AC (1 min) |
| 3. Physical | |||
| Circuits (Loaded) | 5 | Circuits (Maximum) | 5 |
| Color – Housing | _ | Durability (Mating Cycles Max) | _ |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes (USB Micro-B keyed) | Lock to Mating Part | _ |
| Material – Contact | Copper alloy, t = 0.15 mm; Au flash overall with Ni ≥30 µin underplate | Plating on soldering area | _ |
| Plating on contact area | 01/03/05/15/30 µin Au on mating area (per options) | Material – Housing | High-temperature thermoplastic, glass-filled, UL94V-0 |
| Mounting Style | Right Angle | Connector Mounting Type | Board Mount |
| Number of Rows | 1 | Net Weight | — |
| Packaging Type | Tape Reel (TR) | Orientation | Horizontal |
| PCB Retention | Yes — through-hole shield posts | Vacuum Pick-up Cap | _ |
| Polarized to Mating Part | Yes | Temperature Range – Operating | −30 °C to +80 °C |
| Waterproof / Dustproof | No rating stated | Number of Mount legs | 2 (shield posts) |
| Pitch – Termination Interface | 0.65 mm (contacts) | Ports | 1 |
| Termination Interface Style | SMT contacts + Through-hole shell | PCB Thickness (Recommended) | _ |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150 °C | Preheat Temperature Max | Ts(max) = 200 °C |
| Preheat Time (Ts min to max) | ts = 60–120 s | Ramp-up Rate (Ts to Tp) | 3 °C/s max |
| Liquidous Temperature | TL = 217 °C | Time Above TL | tL = 60–150 s |
| Peak Package Body Temp | Tp ≤ TC (see table) | Time within 5 °C of Tp | tp = 20–30 s |
| Ramp-down Rate (Tp to TL) | 6 °C/s max | Time 25 °C to Peak Temp | 8 min max |
| 5. Package Classification Reflow Temperature (TC) | |||
| PB-Free Assembly — Package Thickness < 1.6 mm | 260 °C | Volume mm³ < 350 | 260 °C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260 °C | Volume mm³ 350–2000 | 250 °C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250 °C | Volume mm³ > 2000 | 245 °C |
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