$0.00
SATA 22P Right Angle SMT Receptacle DW-SAT-S22575-XXXX-01 (22 pins: 7 signal + 15 power) for board-level storage interfaces.
Highlights: 22-pin SATA (7+15) in right-angle SMT form
Gold-over-Ni contacts, matte-tin tails for robust reflow soldering
Proven 500-cycle durability; –25 °C to +85 °C operation
Compact footprint with locating pegs for assembly accuracy
Applications : HDD/SSD backplanes, SBCs, DVR/NVR, industrial PCs, servers, storage adapters.
SATA 22P Right Angle SMT Receptacle DW-SAT-S22575-XXXX-01 is a board-mount socket for 22-pin SATA storage (7 signal + 15 power). It uses a right-angle, top-mount SMT configuration with segregated signal and power rows on 1.27 mm pitch.
| General | ||||
| Product Type | SATA Receptacle | Interface Type | SATA 7+15P (22P) | |
| Positions (Contacts) | 22 | Pitch (mm) | 0.80 TYP / 1.27 TYP | |
| Mounting Type | SMT | Orientation | Right-angle (horizontal) | |
| Connector System | Cable-to-Board | Mating Direction | Parallel to PCB (right-angle) | |
| Mating Cycles (Durability) | 500 cycles | Latch/Keying | SATA latch windows; keyed per SATA spec | |
| Number of Rows | 2 (staggered signal/power) | Number of Ports | 1 | |
| Model No. | DW-SAT-S22575-XX TP-01 | Status | Active | |
| RoHS | Compliant | REACH | — | |
| Halogen Free | — | UL Flammability | UL94 V-0 | |
| Electrical | ||||
| Voltage Rating (V) | — | Current Rating (A per contact) | 1.5 | |
| Contact Resistance (mΩ max) | 30 | Insulation Resistance (MΩ min) | 1000 | |
| Dielectric Withstanding Voltage | 500 VAC | Operating Temperature (°C) | −25 ~ +85 | |
| Physical | ||||
| Housing/Insulator Material | LCP, 30% G/F, UL94 V-0 | Color | Black | |
| Contact Base Material | C2680R-H (Cu alloy), t=0.25±0.01 mm | Peg Material | C2680R-H, t=0.30±0.02 mm | |
| Contact Plating (Mating Area) | Gold plating (option codes: 01/03/06/15/30 µin) | Tail Plating | 100 µin Tin on solder tails | |
| Underplating | Nickel ≥ 50 µin overall | Peg Finish | Tin ≥ 100 µin, Ni underplate ≥ 50 µin | |
| Mating Force | 45 N max | Withdrawal Force | ≥ 10 N | |
| Solder Process Data | ||||
| Lead-Free Process Capability | Pb-free reflow compatible | Peak Temp (°C) | — | |
| Reflow/Wave Cycles (Max) | — | Termination to PCB | SMT | |
| Packaging | ||||
| Packaging Method | TR = Tape Reel; TB = Tube; TP = Tray | Packaging Quantity | ( based on customer requirements ) | |
There are no reviews yet.