$0.15
SIM Card Holder Push-Pull SMT 8P 2.8 mm DW-SM-62802-XXTR-01 This is a top-mount SMT SIM card holder designed for compact devices. It features a push-pull mechanism with sliding LOCK/OPEN cover and integrated card guidance. The contact row follows the 8-pin SIM footprint (C1–C8) on 0.80 mm pad pitch with a recommended PCB layout provided in the drawing.
Application : Cellular modules, IoT gateways, POS/terminals, smart meters, asset trackers, handheld devices.
Product Highlight : Push-pull with slider lock for secure retention
Low 2.8 mm profile and SMT footprint for dense designs
≥5,000 cycles durability; –40 °C to +85 °C operation
Multiple gold thickness options to balance cost and life
SIM Card Holder Push-Pull SMT 8P 2.8 mm DW-SM-62802-XXTR-01 is a top-mount, surface-mount SIM socket designed for compact cellular and IoT devices that need robust card retention with easy serviceability.
| 1. General Field |
Value | Field | Value |
| Status | Active | Category | Memory / SIM Card Connectors |
| Series | DW-SM-62802-XXTR-01 | Description | SIM Card Holder, Push-Pull, 6-contact loaded, 2.8 mm height |
| Comments | RoHS 2002/95/EC compliant; MPQ 800 pcs/reel | Product Name | SIM Card Holder |
| Style | Top-mount, push-pull with LOCK/OPEN cover | UPC | — |
| 2. Electrical Field |
Value | Field | Value |
| Current – Maximum per Contact | 1.0 A | Voltage – Maximum | 15 V DC |
| Shielded | Yes — metal shell | Housing Material | LCP, UL94-V0 |
| 3. Physical. Field |
Value | Field | Value |
| Card Detection Switch | N/A (not shown) | Card Entry Location | Top / Front (push-pull) |
| Circuits (Loaded) | 6 (C1, C2, C3, C5, C6, C7) | Circuits (Maximum) | 8 (SIM footprint C1–C8) |
| Color – Resin | Black | Durability (Mating Cycles Max) | ≥ 5,000 cycles |
| Ejector Button Side | N/A (no button; push-pull) | Material – Contact | Copper alloy |
| Material – Plating Mating | Gold on mating area (series code defines thickness) | Material – Plating Termination | Tin over Ni (series-dependent) (not explicitly stated; typical for series) |
| Material – Resin | LCP UL94-V0 | Material – Shell | Stainless steel / metal alloy, nickel-plated (per “Metal Alloy” description) |
| Net Weight | ≈ 0.34 g | Packaging Type | Tape-and-reel (MPQ 800 pcs/reel) |
| PCB Locator | None shown (no pegs/NPTH in layout) | PCB Retention | SMT solder tabs / hold-downs |
| Pitch – Mating Interface | SIM standard contacts; 2.54 mm spacing between C1–C2–C3 (per layout callouts) | Pitch – Termination Interface | Series-specific; staggered tails (not uniformly pitched) |
| Temperature Range – Operating | −40 °C ~ +85 °C | Termination Interface Style | SMT (surface-mount) |
| 4. Solder Process Data Field |
Value | Field | Value |
| Max-Duration | 5000 | Max-Cycle | 5,000 (mechanical durability) |
| Lead-Free Process Capability | Pb-free reflow compatible (peak temp not specified) | Max-Temp | Not specified on drawing |
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