$0.31
Micro SIM Push SMT Connector designed for compact devices. It features a push-push eject mechanism in a top-mount SMT configuration with a built-in card-detect switch and shell-to-ground contact.
Highlights: Push-push eject; built-in card-detect + shell ground; top-mount SMT with 1.27 mm pitch; low profile with defined keep-outs; eject travel 5.50; coplanarity ≤0.10 mm; multiple Au thickness options; tape-and-reel; RoHS/REACH.
Applications: Smart meters, POS/payment terminals, cellular gateways/routers, M2M/IoT modules, handheld devices.
Micro SIM Push SMT Connector DW-SM-61409-XXTR-01 is a low-profile, top-mount Micro-SIM socket that combines a smooth push-push eject mechanism with an integrated card-detect switch and shell-to-ground contact for reliable presence sensing and EMI control.
| General | |||
| Status | Active | Category | SIM card connector |
| Series | DW-SM-61409-XXTR-01 | Description | 1.27 mm-pitch Micro-SIM Card Connector, Hinge Type, Lead-Free |
| Comments | RoHS compliant; non-cumulative tolerances; switch moving area noted | Product Name | Micro-SIM Card |
| Style | Hinge / flip-cover | UPC | — |
| Electrical | |||
| Current – Maximum per Contact | 1.0 A | Voltage – Maximum | 15 V DC |
| Shielded | Yes — stainless-steel cover/shell | ||
| Physical | |||
| Card Detection Switch | YES | Card Entry Location | Front |
| Circuits (Loaded) | 8 | Circuits (Maximum) | 8 |
| Color – Resin | Black | Durability (Mating Cycles Max) | 5000 |
| Ejector Button Side | N/A | Material – Contact | Copper alloy (Ni barrier) |
| Material – Plating Mating | Gold on contact (Au flash/3/5/15/30 µin over Ni 40–200 µin) | Material – Plating Termination | Tin over Ni (hold-downs Au flash over Ni) |
| Material – Resin | LCP UL94V-0 | Material – Shell | Stainless steel |
| Net Weight | — | Packaging Type | Tape & Reel (TR-01) |
| PCB Locator | None | PCB Retention | Yes — SMT shell hold-downs/tabs |
| Pitch – Mating Interface | 1.27 mm | Pitch – Termination Interface | Staggered SMT tails (non-uniform) |
| Temperature Range – Operating | −40 °C ~ +85 °C | Termination Interface Style | Surface Mount (SMT) |
| Solder Process Data | |||
| Max-Duration | — | Max-Cycle | — |
| Lead-Free Process Capability | Pb-free reflow compatible | Max-Temp | — |
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