$0.23
This USB 2.0 Type-A dual stacked receptacle helps designers save front-panel space, simplify assembly, and maintain consistent solder joints in automated lines. It is RoHS/REACH compliant and supplied in tray packing. Typical uses include PCs and hubs, set-top boxes, gateways/routers, industrial controllers, and embedded SBCs where a dependable, right-angle USB A interface is required.
Highlights: Dual stacked USB A saves front-panel space; right-angle THT with shield stakes for strong retention; multiple Au thickness options (01/03/05/15/30) on mating area; −40~+85 °C operating range; RoHS & REACH compliant.
Applications: PCs & USB hubs, set-top boxes, gateways/routers, industrial controllers, embedded boards/SBCs.
The USB 2.0 Type-A Dual Stacked Receptacle DW-U20-DA803 is a right-angle, through-hole (THT) connector engineered for compact, board-edge I/O.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-U20-DA803-XX TP-02 | Description | USB 2.0 Type-B Receptacle, Through-Hole, Dual Port araight angle DIP Type |
| Application | DW-U20-DA803-XX TP-02 | Comments | Terminal plating options: 01/03/05/15/30 Au on mating area; TP: Tray Packing |
| Component Type | Receptacle | Product Name | USB Type-B |
| USB Version | USB 2.0 | Type | Type-B |
| Keywords | USB Type-B, 4 Pin, Through-Hole, Shielded | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 0.5A | Grounding to Panel | Gold Flash |
| Shielded | Yes | Shield Type | NICKEL UNDERPLATNG |
| Voltage – Maximum | 30V AC | Contact Resistance | 30mΩ Max |
| Insulation Resistance | 100MΩ Min (100V DC) | Dielectric Withstanding Voltage | 750V AC at Sea Level |
| 3. Physical | |||
| Circuits (Loaded) | 4 | Circuits (Maximum) | 4 |
| Color – Housing | Black | Durability (Mating Cycles Max) | 5000 |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | Yes |
| Material – Contact | C2680 Copper Alloy | Plating on soldering area | Tin |
| Plating on contact area | Gold | Material – Housing | PBT, UL94V-0 |
| Mounting Style | Through-Hole | Connector Mounting Type | Board Mount |
| Number of Rows | 1 | Net Weight | |
| Packaging Type | Tray Packing | Orientation | Horizontal |
| PCB Retention | Yes | Vacuum Pick-up Cap | – |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -40°C to +85°C |
| Waterproof / Dustproof | Yes | Number of Mount Legs | 4 |
| Pitch – Termination Interface | 2.00 mm | Ports | 1 |
| Termination Interface Style | Through-Hole | PCB Thickness (Recommended) | 1.6 mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ TC (see table below) | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | Volume mm³ < 350 | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | Volume mm³ 350–2000 | 250°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | Volume mm³ > 2000 | 245°C |
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