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Built for tough boards, the USB 2.0 Type-A female connector uses a 180° long-tail DIP pin field and shell stakes to create deep, high-strength solder joints. Gold-finished contacts and a nickel-plated shell keep resistance low across 1500+ insertions, while the 7.2 mm front outline fits tight panels. Rated 1.5 A, 500 V AC withstand, and ≥1000 MΩ insulation, it’s a reliable USB 2.0 port for PCs, storage, hubs, and industrial control cards.
Key Features at a Glance
180° long-tail DIP Type-A receptacle; right-angle through-hole
7.2 mm front OD; shell stakes for strong retention
Electrical: 1.5 A, 500 V AC/1 min, ≥1000 MΩ insulation, ≤30 mΩ contact
Mechanical: ≤35 N mate, ≥10 N unmate, ≥1.2 kgf contact retention, ≥1500 cycles
Materials: UL94V-0 PBT/LCP housing; Au-over-Ni contacts; nickel-plated metal shell
Operating −55~+85 °C; RoHS/REACH compliant
Highlights
Long-tail pins for superior solder pull-out, wave-solder friendly footprint, durable contact/shell system, and stable performance in industrial environments.
Applications
Desktop PCs • Servers • External drives • USB hubs • Industrial controllers • Commercial/AV equipment.
USB 2.0 Type-A female connector for robust, through-hole assemblies that need extra solder bite and panel stability. This right-angle 180° long-tail DIP receptacle uses extended pins and four shell stakes to anchor the jack during wave solder, delivering strong peel resistance on vibration-prone or serviceable equipment.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | USBAFDIP-605-04TP-XX | Description | USB Type-A Female, 4PIN, Right Angle DIP, Long Body with Lock Pegs |
| Application | wire to board /Cable-to-Board | Comments | Lock tab & extended housing |
| Component Type | Receptacle | Product Name | USB Type-A |
| USB Version | USB 2.0 | Type | Type-A |
| Keywords | USB A Connector, Type-A USB Socket, DIP USB Connector, Locking USB Port, Right Angle USB Female, Panel Mount USB | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.5A (VBUS & GND) | Grounding to Panel | Yes (via shell) |
| Shielded | Yes | Shield Type | Full Shield, Front & Rear Tabs |
| Voltage – Maximum | 500V AC | Contact Resistance | 30mΩ Max |
| Insulation Resistance | 1000MΩ Min | Dielectric Withstanding Voltage | 500V AC/min |
| 3. Physical | |||
| Circuits (Loaded) | 4 | Circuits (Maximum) | 4PIN |
| Color – Housing | Black | Durability (Mating Cycles Max) | 1,500 Cycles |
| Flammability | PBT UL94V-0 / LCP | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | Yes |
| Material – Contact | Copper Alloy (T=0.25mm) | Plating on soldering area | Tin Plated |
| Plating on contact area | Gold Flash Plating | Material – Housing | PBT or LCP |
| Mounting Style | DIP (Through-Hole) | Connector Mounting Type | Board Mount, Lock Pegs |
| Number of Rows | 1 (Signal) + Pegs | Net Weight | – |
| Packaging Type | Tray Packing | Orientation | Right Angle |
| PCB Retention | Yes | Vacuum Pick-up Cap | No |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -55°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 4 tabs + 2 lock pegs |
| Pitch – Termination Interface | 2.50 mm | Ports | 1 |
| Termination Interface Style | Through-Hole | PCB Thickness (Recommended) | 1.6 mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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