USB 3.0 AF double deck female connector right angle 9 pin H=9.91mm for compact dual-port PCB USB interface applications, designed with stacked USB Type-A female ports, right-angle mounting, and a blue USB 3.0 insulator structure. Based on the drawing, this connector features 9 contacts per port, reflow solder capability up to 260°C, and durable plated contact and shell materials for reliable board-level connection.
• Applications: Industrial computers, embedded systems, communication devices, control panels, consumer electronics, server equipment, interface boards, compact dual-USB port modules.
• Highlights: USB 3.0 AF double deck connector; dual stacked female ports; right-angle PCB type; 9-pin per port; H=9.91mm; blue USB 3.0 insulator; 30u” gold plating on contact area; matte tin on solder tails; nickel-plated shell; reflow solder capable to 260°C
USB 3.0 AF double deck female connector right angle 9 pin H=9.91mm is a stacked USB receptacle designed for high-density PCB interface applications where two USB Type-A ports are required in a compact vertical arrangement. Based on the drawing, this connector is a USB 3.0 AF double deck receptacle with two stacked female ports, right-angle PCB mounting, 9-pin contact structure per port, and an overall height marked as H=9.91mm. The recommended PCB layout and panel cutout shown in the drawing support practical integration into equipment housings and PCB assemblies.
This USB 3.0 AF double deck female connector right angle 9 pin H=9.91mm uses a high temperature thermoplastic housing and cover with glass fiber filled UL94V-0 material, and the housing color is specified as blue, which is commonly used to identify USB 3.0 connectors. The contact materials are listed as brass for contact pins 5P and phosphor bronze for contacts 4P, while the shell material is SUS201 and the isolated part is SK7.
The plating specification in the drawing states 30u” minimum gold plating on the contact area, 100u” minimum matte tin on the solder tail, and 50u” minimum nickel underplating overall. The shell is specified with 50u” minimum nickel plating overall, and the isolated part is also nickel plated. The drawing further notes that the connector is reflow solder capable to 260°C.
With its double deck USB Type-A structure, right-angle board mounting, and USB 3.0 blue insulator design, this stacked USB 3.0 female connector is suitable for industrial computers, embedded systems, control panels, communication devices, servers, and consumer electronics that require dual USB ports in limited PCB space.
| General | |||
| Status | Active | Category | USB Connector |
| Model No. | DW-MU3-SA18081-XXXX-01 | Description | USB 3.0 Type-A female dual-port stacked connector, right-angle panel-mount style |
| Component Type | Receptacle | Product Name | USB 3.0 AF Dual Port |
| RoHS | Compliant | Packaging | Tray / Tape Reel |
| Electrical | |||
| Current Rating | — | Voltage Rating | — |
| Contact Resistance | — | Insulation Resistance | — |
| Dielectric Withstanding Voltage | — | Operating Temperature | — |
| Reflow Capability | 260°C | Electrical Specification | — |
| Physical | |||
| Number of Contacts | 18 | Port Type | USB 3.0 Type-A Female |
| Number of Ports | 2 | Mounting Type | Right Angle, Through Hole, Panel Mount |
| Overall Height | 23.60 mm | Overall Width | 15.60 mm |
| Front Width | 13.90 mm | Body Length | 17.25 mm |
| Front Opening Height | 8.50 mm | Recommended Panel Cutout | 13.55 mm × 8.50 mm |
| Insulating Housing & Cover | High Temperature Thermoplastic, Glass Fiber Filled, UL94V-0 | Housing Color | Blue |
| Contacts 5PIN Material | Brass | Contacts 4PIN Material | Phosphor Bronze |
| Shell Material | SUS201 | Isolated Material | SK7 |
| Contact Finish | 30u” Min Gold on contact area | Solder Tail Finish | 100u” Min Matte Tin |
| Underplating | 50u” Min Nickel Underplated Overall | Shell Finish | 50u” Min Nickel Plated Overall |
| Isolated Finish | 50u” Min Nickel Plated Overall | Contact Pitch | 0.40 mm |
| Terminal Plating Options | Gold Flash / 3u” / 5u” / 15u” / 30u” | Series | Jan-99 |
| Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
