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USB 3.0 Type-A Right-Angle Receptacle SMT 9P (DW-MU3-SA09078) A receptacle designed for board-edge mounting in compact devices. It features a right-angle, top-mount configuration with SMT signal pins and through-hole shield stakes for robust retention.
Highlights: Right-angle top-mount; SMT pins + THT shield stakes; 9-pin SuperSpeed pinout (SSRX/SSTX pairs); 1.00 mm pad pitch; ≥1,500 cycles; −40~+85 °C; selectable Au thickness RoHS/REACH.
Applications: PCs and hubs, set-top boxes/gateways, network equipment, industrial controllers, consumer electronics.
USB 3.0 Type-A Right-Angle Receptacle SMT 9P DW-MU3-SA09078-01TR-01 is a board-edge socket for SuperSpeed USB in compact devices. It uses a top-mount architecture with SMT signal pads on 1.00 mm pitch and through-hole shield stakes for strong mechanical retention and reliable chassis grounding.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MU3-SA09078-XX TR-01 | Description | USB 3.0 Type-A Receptacle, Right Angle, Through-Hole, 9 Pin, Shielded |
| Application | Cable-to-Board | Comments | Terminal plating options: 01/03/05/15/30 Au on mating area; TP: Tray Packing |
| Component Type | Receptacle | Product Name | USB Type-A |
| USB Version | USB 3.0 Type-A | Type | Type-A |
| Keywords | USB Type-A, Right Angle, 9 Pin, Through-Hole, Shielded | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.5A | Grounding to Panel | Yes (shell to GND pads) |
| Shielded | Yes | Shield Type | Metal shell with boardlocks |
| Voltage – Maximum | Contact Resistance | 30mΩ Max | |
| Insulation Resistance | 100MΩ Min | Dielectric Withstanding Voltage | 100V AC |
| 3. Physical | |||
| Circuits (Loaded) | 9 | Circuits (Maximum) | 9 |
| Color – Housing | Durability (Mating Cycles Max) | 1,500 | |
| Flammability | Gender | Female / Receptacle | |
| Keying to Mating Part | Yes (USB-A keyed) | Lock to Mating Part | Friction latch via shell springs |
| Material – Contact | Bronze | Plating on soldering area | Tin |
| Plating on contact area | Gold | Material – Housing | High Temperature Plastic |
| Mounting Style | Right Angle, Through-Hole | Connector Mounting Type | Board Mount |
| Number of Rows | 1 | Net Weight | |
| Packaging Type | Tray Packing | Orientation | Horizontal |
| PCB Retention | 2 through-hole stakes (boardlocks) | Vacuum Pick-up Cap | No |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -40°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 2 |
| Pitch – Termination Interface | 0.70 mm (contacts) | Ports | 1 |
| Termination Interface Style | Through-Hole | PCB Thickness (Recommended) | |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ TC (see table below) | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | Volume mm³ < 350 | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | Volume mm³ 350–2000 | 250°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | Volume mm³ > 2000 | 245°C |
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