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Compact USB Type-C 3.1 24Pin Receptacle combining fine-pitch SMT contacts with through-hole shell stakes for rugged retention and low EMI. Nickel-plated stainless-steel shielding and Au-over-Ni contacts maintain low resistance through 10k cycles. Rated 3 A, 100 VAC withstand, –30~+85 °C operation. Ideal for mobile, computing, automotive, and industrial designs needing reliable Type-C I/O in a small package.
Key Features at a Glance
Highlights
Rugged SMT + post construction resists peel and cable load while preserving signal integrity. Full Type-C pinout supports power, CC negotiation, SBU, and SuperSpeed pairs in one compact shielded jack.
Applications
Mobile phones & tablets • USB-PD chargers & hubs • Computers & peripherals • Automotive infotainment • Industrial control & HMI • Test instruments • Smart home and IoT gateways
USB Type-C 3.1 24Pin Receptacle for compact, high-reliability board I/O where Type-C interoperability and rugged PCB anchoring are required. This right-angle receptacle uses a hybrid SMT + DIP structure: fine-pitch surface pads carry high-speed pairs while large through-hole shell stakes/ground tabs lock the connector to the board and improve EMI return.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MUB-CF02446-24TR-01 | Description | USB Type-C Receptacle, 24PIN, SMT Mid-Mount with Metal Shell & Side Clips |
| Application | wore to board /Cable-to-Board | Comments | Mid-mount with dual iron shell holders |
| Component Type | Receptacle | Product Name | USB Type-C |
| USB Version | USB 3.1 | Type | Type-C |
| Keywords | USB Type-C Connector, USB Type-C Receptacle, Mid Mount USB-C, Side Clip Type C Connector, SMT Type-C Port, 24PIN USB-C Connector | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 3A Max | Grounding to Panel | Yes (via metal shell) |
| Shielded | Yes | Shield Type | Full Shield with Side Clip Retainers |
| Voltage – Maximum | 30V AC | Contact Resistance | 40mΩ Max |
| Insulation Resistance | 100MΩ Min | Dielectric Withstanding Voltage | 100V AC for 1 Minute |
| 3. Physical | |||
| Circuits (Loaded) | 24PIN | Circuits (Maximum) | 24PIN |
| Color – Housing | Black | Durability (Mating Cycles Max) | 10,000 Cycles |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | Yes |
| Material – Contact | Copper Alloy | Plating on soldering area | Au/Ni Plated |
| Plating on contact area | Gold Plated | Material – Housing | High Temp Plastic |
| Mounting Style | SMT (Surface Mount) + Side Retention Legs | Connector Mounting Type | Mid Mount with Shell Brackets |
| Number of Rows | Dual Row | Net Weight | – |
| Packaging Type | Tape and Reel | Orientation | Horizontal |
| PCB Retention | Yes (with side brackets) | Vacuum Pick-up Cap | No |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -30°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 4 Tabs + 2 Shell Brackets |
| Pitch – Termination Interface | 0.50 mm | Ports | 1 |
| Termination Interface Style | RIGHT ANGLE | PCB Thickness (Recommended) | 1.6 mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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