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Sealed USB-C receptacle with a vertical DIP footprint and sunken-board 1.58 mm profile. Laser-welded stainless shield and silicone gasket achieve IPX7/8 water protection, while through-hole posts deliver strong panel retention. Rated VBUS 5 A, AC 100 V dielectric, ≥100 MΩ insulation, and 10k cycles from −20 ~ +85 °C. Implements the core 16-pin map (VBUS/GND, D±, CC1/CC2, SBU1/2) for USB-PD. A dependable waterproof Type-C port for rugged electronics.
Key Features at a Glance
IPX7/8 waterproof structure; laser-welded shield + silicone gasket
Vertical right-angle DIP with robust shell stakes
Sunken board 1.58 mm low profile; panel width ≈12.80 mm
VBUS up to 5 A, AC 100 V withstand, ≥100 MΩ insulation
10,000 cycles durability; −20 ~ +85 °C operation
Gold-finished contacts, nickel-plated stainless shell; RoHS/REACH compliant
Highlights
Sealed, compact Type-C; strong through-hole retention; USB-PD ready (CC1/CC2); reliable in wet, dusty, or wash-down environments.
Applications
Rugged handhelds • Industrial controllers • Automotive/telematics • Medical devices • Outdoor consumer gear • Marine/field instruments.
USB Type-C vertical waterproof connector engineered for rugged I/O panels that need a sealed Type-C charge/data port with through-hole strength. The receptacle uses a sunken-board 1.58 mm profile and a vertical right-angle DIP footprint that anchors the shell and contacts to the PCB for excellent peel-off resistance. A stainless-steel housing with laser-welded seams and a molded silicone gasket form a water-tight barrier; the drawing specifies vent/press points and weld locations (19x) and a recommended PCB pattern with keep-outs centered on an 8.00 mm pin field and 12.80 mm panel width.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MUB-CF016104-16TR-01 | Description | USB Type-C Female Connector, Sunken Board 1.58 Mid-Mount, 16PIN, Screw Flange, Laser Welded |
| Application | Wire-to-Board /Cable-to-Board | Comments | With Screw Mount Tabs |
| Component Type | Receptacle | Product Name | USB Type-C |
| USB Version | USB 2.0 Type-C | Type | Type-C |
| Keywords | USB Type-C Mid-Mount, 16PIN Type-C Connector, CL=3.00mm USB-C, Flanged USB-C, SMT Type-C, Screw Mount USB Connector, Recessed USB Type-C | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 5A VBUS, 1.25A Others | Grounding to Panel | Yes |
| Shielded | Yes | Shield Type | Full Shield |
| Voltage – Maximum | 30V AC | Contact Resistance | 40mΩ Max |
| Insulation Resistance | 100MΩ Min | Dielectric Withstanding Voltage | 100V AC |
| 3. Physical | |||
| Circuits (Loaded) | 16 | Circuits (Maximum) | 16P |
| Color – Housing | Black | Durability (Mating Cycles Max) | 10,000 |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | Yes |
| Material – Contact | Copper Alloy | Plating on soldering area | Gold |
| Plating on contact area | Gold | Material – Housing | High Temp Plastic UL94V-0 |
| Mounting Style | Recessed Mid-Mount SMT with Screw Tabs | Connector Mounting Type | Board Mount |
| Number of Rows | 2 | Net Weight | – |
| Packaging Type | Tape and Reel | Orientation | Horizontal |
| PCB Retention | Yes | Vacuum Pick-up Cap | Yes |
| Polarized to Mating Part | Yes | Temperature Range – Operating | 20°C to +85°C |
| Waterproof / Dustproof | Yes. IPX7 | Number of Mount legs | 2 |
| Pitch – Termination Interface | 0.5 mm | Ports | 1 |
| Termination Interface Style | Vertical | PCB Thickness (Recommended) | 8mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ TC (see table below) | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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