$0.11
0.8mm vertical SMT wire-to-board header Precision Micro-Pitch, Single-Row Designed for tight boards, pairs micro-pitch density with production-friendly assembly. Gull-wing leads and separate hold-downs create a rigid footprint that prints cleanly and survives reflow and handling. Copper-alloy terminals with nickel underplate and tin on the solder pads give strong joints; optional gold on the mating area supports repeated insertions. With 500 V dielectric strength, ≤30 mΩ contact resistance, and −25 ~ +85 °C operation, it drops neatly into wearables, light engines, and embedded controllers where polarized, vertical cable entry saves space and simplifies harness routing.
Key Features at a Glance
0.80 mm micro-pitch, single row; vertical (180°) orientation
SMT gull-wing leads plus hold-down anchor pads
Land pattern: 0.80 ± 0.05 mm pitch, pad width ≥0.50 mm
Electrical: ≥1000 MΩ insulation, 500 V AC/DC withstand, ≤30 mΩ contact
Materials: copper-alloy terminals; UL94V-0 high-temp nylon housing
Finishes: Ni ≥30 µin underplate; Sn ≥60 µin on pads; Au options on mating area
Solder-heat resistance 260 °C ±5 °C / 5 s; tape-and-reel packaging
Highlights
Micro-pitch density without sacrificing retention; polarized walls and standoff aid automated assembly; plating options align cost with lifecycle needs.
Applications
Wearables • Handhelds • IoT modules • LED/light bars • Small appliances • Industrial controllers • Consumer electronics.
0.8mm vertical SMT wire-to-board header for compact harness terminations where low profile and strong reflow attachment are essential. This single-row connector uses gull-wing leads with dedicated hold-down pads, providing mechanical stability during placement and cable pull. The recommended PCB layout on the drawing specifies 0.80 ± 0.05 mm pad pitch, pad width ≥0.50 mm, and separate anchor pads (~0.64 mm) to resist peel; overall length scales with position count (see table). Polarization walls and a slight standoff promote reliable seating and flux wash.
| 1.General | |||
| Status | Active | Product Name | Wafer Connector, Micron pitch wire-to-board header, |
| Part Number | DW-WF-108059WV08-01TR-02 | Description | 0.80 mm SMT Wafer, Vertical (180°) |
| Component Type | Wafer (SMT) | Comments | Single-row header |
| 2.Electrical | |||
| Current – Maximum per Contact | |||
| Insulation Resistance | 1000 MΩ Min. | Voltage – Maximum | |
| Contact Resistance | 30 mΩ Max. | Withstanding Voltage | 500 V AC/DC (1 minute) |
| 3.Physical | |||
| Circuits (Loaded) | (nP per ordering) | Termination Interface Style | Surface Mount |
| Color | Resin | Circuits | (maximum) |
| Glow-Wire Capable | _ | Durability | (mating cycles max) |
| Mated Height | 1.70 mm (1.5 mm option) | Lock to Mating Part | _ |
| Material – Metal | Copper Alloy (Terminal) | Mated Width | _ |
| Material – Plating Termination | Sn 60 µin min over Ni 30 µin min | Material – Plating Mating | Sn 60 µin min over Ni 30 µin min |
| Material – Resin | High-temperature Nylon, UL94 V-0 | Net Weight | _ |
| Number of Rows | 1 (Single Row) | Material – Shell | _ |
| Packaging Type | Tape & Reel (TR-02); Tube package (TB) | Orientation | Vertical (180°) |
| PCB Retention | _ | PCB Locator | _ |
| Pitch – Termination Interface | 0.80 mm | Pitch – Mating Interface | 0.80 mm |
| Polarized to Mating Part | Plating min – Mating | Sn 60 µin min / Ni 30 µin min | |
| Temperature Range – Operating | −25 °C to +85 °C | Polarized to PCB | _ |
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