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The 1.25mm SMT vertical wafer header – Precision Single-Row brings micro-pitch connectivity to tight boards without sacrificing process reliability. Broad hold-down anchors create a rigid footprint that prints cleanly, survives reflow, and stands up to harness pull. Nickel underplate with tin on the solder pads produces strong joints, while selectable gold on the contact area lets you balance cost and mating durability. With 1 A / 125 V capability, 250 V AC withstand, and −25~+85 °C operation, it drops neatly into wearables, light engines, and embedded controllers where vertical cable entry and clear polarization simplify routing and assembly.
Key Features at a Glance
1.25 mm fine pitch; single row, vertical (180°) orientation
SMT gull-wing leads plus large hold-down pads
Land pattern: 1.25 ±0.10 mm pitch, 0.80 ±0.10 mm pad width; anchors 3.60 ±0.10 mm
Electrical: 1 A, 125 V, ≤20 mΩ contact, ≥100 MΩ insulation, 250 V AC/1 min
Materials: LCP UL94 V-0 housing (white); brass contacts/anchors
Finishes: Au over Ni on mating area (Flash/3/6/15/30 µin); Sn on solder pads
Tape-and-reel packaging; RoHS/REACH compliant
Highlights
Micro-pitch density with production-grade retention; polarization walls and standoff aid inspection; plating options align reliability with budget.
Applications
Consumer electronics • IoT modules • LED light bars • Handhelds • Small appliances • Industrial controllers.
1.25mm SMT vertical wafer header for compact harness terminations that demand strong reflow attachment and clear polarization. This single-row, 180° vertical connector uses gull-wing leads plus large “solder-nail” hold-down pads to resist peel during cable handling.
| General | |||
| Status | Active | Category | Wafer |
| Product Name | Wafer Connector | Description | 1.25 mm SMT Wafer, Vertical (180°) |
| Part Number | DW-WF-112536WV03p-31TR-XX | Component Type | Wafer (SMT) |
| Electrical | |||
| Field | Value | Field | Value |
| Current – Maximum per Contact | 1 A AC/DC | Voltage – Maximum | 125 V AC/DC |
| Insulation Resistance | 100 MΩ Min. | Withstanding Voltage | 250 V AC/Minute |
| Contact Resistance | 20 mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 3–6 (per table) | Circuits (maximum) | 6 |
| Color – Resin | White (LCP, UL94 V-0) | Durability (mating cycles max) | |
| Glow-Wire Capable | _ | Lock to Mating Part | _ |
| Mated Height | 3.65 mm | Mated Width | B per table: 03→8.60 mm; 04→9.85 mm; 05→11.10 mm; 06→12.35 mm |
| Material – Metal | Brass (Contacts) | Material – Plating Mating | Per code: 01 Gold Flash / 03 3 µin Au / 06 6 µin Au / 15 15 µin Au / 30 30 µin Au / 31 Sn / 32 Ni |
| Material – Plating Termination | Per code: 01 Gold Flash / 03 3 µin Au / 06 6 µin Au / 15 15 µin Au / 30 30 µin Au / 31 Sn / 32 Ni | Net Weight | _ |
| Material – Resin | LCP, UL94 V-0 (White) | Material – Shell | Brass |
| Number of Rows | 1 (Single Row) | Orientation | Vertical (180°) |
| Packaging Type | Tape & Reel (TR) or Tube Package (TB) | PCB Locator | _ |
| PCB Retention | Yes — solder nails (Brass) | Pitch – Mating Interface | 1.25 mm |
| Pitch – Termination Interface | 1.25 mm | Plating min – Mating | Per code (see above) |
| Polarized to Mating Part | _ | Polarized to PCB | _ |
| Temperature Range – Operating | −25 °C to +85 °C | Termination Interface Style | Surface Mount |
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