$0.00
1.27mm Pin Header Dual Rows SMT Type Base 2.0H with Cap is a dual-row brass SMT header on 1.27mm pitch, featuring Ni/Au-plated 0.40mm posts, PA6T UL94V-0 housing and 2A per pin rating, optimized for dense board-to-board links and automated reflow assembly.
Applications:
Compact embedded controller and communication boards
SMT board-to-board headers in telecom and networking devices
High-density signal connectors in IoT and handheld equipment
Fine-pitch stacking headers for mezzanine or daughter cards
Highlights:
1.27mm pin header dual rows SMT type base 2.0H with cap
Square 0.40mm brass pins on 1.27mm pitch, dual-row 0.80mm spacing
Electrical ratings: 2A/contact, ≤20mΩ contact resistance, ≥1000MΩ insulation, AC 500V withstand
Ni 30–50µ” underplate with Au 0.5–0.8µ” finish for long-term conductivity
PA6T + 30% GF UL94V-0 housing; reflow capable to 260°C ±5°C
Delivered in tape & reel for high-speed SMT placement; RoHS, REACH SVHC and low-halogen compliant
1.27mm Pin Header Dual Rows SMT Type Base 2.0H with Cap is a fine-pitch surface-mount connector designed for compact board-to-board and signal interconnects. This 1.27mm Pin Header Dual Rows SMT Type Base 2.0H with Cap follows the drawing title “1.27PIN HEADER DUAL ROWS SMT TYPE BASE 2.00H” and uses two parallel rows of brass posts on a 1.27mm (.050″) grid for dense routing on modern PCBs.
| General | |||
| Status | Active | Category | PCB Headers and Receptacles |
| Series | DW-PH-2127192WV20P-01TR-01 | Description | 1.27mm Pitch Dual Row Pin Header, SMT Type, 2.00mm Base Height, Gold Plated Contacts, Tape & Reel Packaging with Cap |
| Application | Board-to-Board, Signal, Wire-to-Board | Component Type | Connector Assembly |
| PCB Connector Type | PCB Mount connector | UPC | — |
| Keywords | Board-to-Board connector, Pin Header, SMT Pin Header, Header connector, Dual Row Pin Header, Right Angle Pin Header, Surface Mount Pin Header, Electronic Connector | Connector & Contact Terminates to | Printed Circuit Board |
| Electrical | |||
| Rated Voltage | AC 500V | Current Rating | 2.0A |
| Contact Resistance | ≤20mΩ Max | Insulation Resistance | ≥1000MΩ Min |
| Dielectric Withstanding Voltage | AC 500V | Norm | EIA-364C |
| Physical | |||
| Breakaway | No | Circuits (Number of Positions) | 20 |
| Circuits (Maximum) | 50 (series range) | Color – Housing | Black |
| Durability (mating cycles max) | 100 | Flammability | UL94V-0 |
| Glow-Wire Capable | No | Lock to Mating Part | No |
| Material – Metal | Brass | Material – Plating Mating | Au 0.5~0.8μ over Ni |
| Material – Plating Soldering Area | Au over Ni | Material – Resin | PA6T+30%GF UL94V-0 |
| Metal Shape & Form | Square Pin | Number of Rows | 2 |
| Connector Orientation | Vertical / Straight | Packaging Type | Tape & Reel |
| PCB Locator | No | PCB Retention | No |
| PC Tail Length | — | Pitch – Mating Interface | 1.27mm |
| Plating min – Mating | 0.76μm (30μ”) | Plating min – Termination | 0.76μm |
| Polarized to Mating Part | No | Polarized to PCB | No |
| Shrouded | Yes | Stackable | No |
| Operating Temperature | -40° to +105°C | Termination Interface Style | Surface Mount |
| Square Terminal Post & Tail Dimension | 0.40mm x 0.40mm | PCB Mount Retention | W/O |
| PCB Mount Alignment | W/O | Connector Mounting Type | PCB Mount |
| PCB Thickness (Recommended) | 1.57mm | Row-to-Row pitch | 1.27mm |
| Net Weight | — | Height of connector above PCB | 2.00mm |
| Solder Process Data | |||
| Max-Duration | 5~10 sec | Lead-Free Process Capability | IR-Reflow |
| Max-Cycle | 1 | Max-Temp | 260°C ±5°C |
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