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2.00 mm Dual-Row Female Header, Vertical THT (DW-FH-2200509WVNP)

$0.22

2.00 mm Dual-Row Female Header, Vertical THT (DW-FH-2200509WVNP) This female header designed for board-to-board interconnects. It features a vertical (WV, 180°) orientation with through-hole posts for robust PCB anchoring. The series supports per-row pin counts from 2 to 40 (resulting in 2×N total ways).

Highlights: 2.00 mm fine pitch dual-row; vertical THT posts for strong retention; Au plating options (flash–30 µin); wide range 2×2 to 2×40; −40~+105 °C; RoHS/REACH.

Applications: Industrial controllers, communication modules, embedded boards, consumer electronics, I/O daughtercards.

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Quantity Range
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Disc. Price
1-99
$0.22
100-599
$0.22
600-1199
$0.21
1200-5999
$0.20
6000+
$0.18
Delivery By 7 November, Friday
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5-Year Warranty
30-Day Returns
30-Day Exchange

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Description

2.00 mm dual-row female header, vertical THT DW-FH-2200509WVNP-XXTP-01 is a fine-pitch board connector for compact board-to-board links that need strong mechanical retention and stable solder joints.

General
Status Active Category PCB Headers and Receptacles
Series DW-FH-2200509WVNP-XXTP-01 Description 2.0 mm Female Header, Dual Row, Vertical/Right Angle DIP Type.
Application Board-to-Board, Signal/Power Component Type Female Header
Product Name Female Header 2.0mm Dual Row UPC _
Electrical
Current – Maximum per Contact 2A Voltage – Maximum AC 500V
Contact Resistance 20mΩ Max. Insulation Resistance 1000MΩ Min.
Physical
Circuits (Loaded) up to 40 (per PN) Circuits (Maximum) 40
Color – Resin Natural Flammability UL94V-0
Material – Metal Phosphor Bronze Material – Plating Mating Au 0.5–0.8 µ” over Ni 30–50 µ”
Material – Plating Termination Gold/Tin options Material – Resin PA6T UL94V-0
Net Weight _ Number of Rows Dual Row (2)
Orientation Vertical / 90° RA Packaging Type Tray
PC Tail Length 3.68 mm Pitch – Mating Interface 2.00 mm
Plating min – Mating As per code (e.g., 0.5 µ”–30 µ”) Plating min – Termination Gold/Tin
Polarized to PCB _ Temperature Range – Operating -40 °C ~ +105 °C
Termination Interface Style Through Hole
Solder Process Data
Max-Duration 5000 Lead-Free Process Capability Wave
Max-Cycle 5000 Max-Temp 260 °C ±5 °C, 105 MAX

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