$0.06
2.50 mm SMT Wire-to-Board Wafer
2.50 mm SMT wire-to-board wafer, straight (180°). Covers pin counts 2–20. Key dims: mated height 8.30 mm; cap width 5.90 ±0.25 mm; contact span A per PINS table. Recommended PCB layout: 2.50 mm pad pitch, two SMT hold-downs ~3.00 × 5.00 mm, layout tol ±0.05. Electrical: 250 V AC/DC, 3 A per contact, insulation ≥1000 MΩ, dielectric 1000 VAC/min, contact ≤20 mΩ. Materials: brass contacts, tin plated; insulator LCP UL 94V-0. Packaging: tape-and-reel. RoHS compliant.
APPLICATION: Consumer electronics, LED light bars, small appliances, industrial controllers, IoT modules and gateways, any design requiring a 2.50 mm single-row vertical SMT wire-to-board header compatible with locking crimp housings.
PPRODUCTS HIGHLIGHT: 2.50 mm pitch vertical Wafer for standard crimp housings
SMT + hold-downs for strong board retention
Up to 20 positions; compact ~8 mm profile
250 V / 3 A rating with ≤ 20 mΩ contact resistance
2.50 mm SMT Wire-to-Board Wafer, single row with two SMT Vertical (180°); rated 250 V / 3 A, LCP UL94V-0
| 1. General | |||
| Status | Active | Category | Wire to board (WTB) connectors |
| Series | Wire-to-Board Wafer | Description | PH 2.50 mm SMT Wafer, 180° |
| Part Number | DW-WF-125088WVNP-31TR-01 | Comments | Contact plating: Tin plated |
| Component Type | Wafer (SMT) | Product Name | PH Wafer |
| 2. Electrical | |||
| Current – Maximum per Contact | 3A AC/DC | Voltage – Maximum | 250V AC/DC |
| Insulation Resistance | 1000 MΩ Min. | Withstanding Voltage | 1000 V AC/min |
| Contact Resistance | 20 mΩ Max. | ||
| 3. Physical | |||
| Circuits (Loaded) | 6 (array shows 6 pads; A=(N−1)×P → (6−1)×2.50 = 12.50 mm) | Circuits (maximum) | 20 (per PINS table) |
| Color – Resin | Not specified on drawing (Insulator: LCP UL 94V-0) | Durability (mating cycles max) | _ |
| Glow-Wire Capable | Not specified on drawing | Lock to Mating Part | yes |
| Mated Height | 8.30 mm | Mated Width | 5.90 ±0.25 mm |
| Material – Metal | Brass | Material – Plating Mating | Tin (contact material “Brass, Tin plated”) |
| Material – Plating Termination | Tin | Net Weight | _ |
| Number of Rows | 1 | Orientation | Straight (180°) |
| Packaging Type | Tape Reel (TR) | PCB Locator | None shown (no pegs/holes in layout) |
| PCB Retention | Yes – 2 SMT hold-down pads, ~3.00 × 5.00 mm at both ends (see layout) | Pitch – Mating Interface | 2.50 mm |
| Pitch – Termination Interface | 2.50 mm (pad pitch in PCB layout) | Plating min – Mating | Not specified on drawing (series codes list Au/Sn/Ni options) |
| Temperature Range – Operating | −25 °C to +85 °C | Termination Interface Style | Surface Mount |
| Weight | 5 kg |
|---|---|
| Dimensions | 35 × 35 × 35 cm |
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