Micro USB 5P Type-B receptacle right angle mid-mount SMT connector with 0.65 mm pitch, 5-pin USB 2.0 interface, LCP UL94V-0 housing, SUS304 shield, copper alloy contacts, 1A current rating, and tape & reel packaging for compact PCB power and signal applications.
Applications
• USB 2.0 power and signal connection
• Portable electronic devices
• Consumer electronics
• Communication equipment
• Charging interface modules
• Embedded PCB boards
• Industrial handheld devices
• Smart devices and accessories
• Cable-to-board USB interface applications
Highlights
• Micro USB 5P Type-B receptacle connector
• Right angle orientation
• Mid-mount SMT design
• 0.65 mm pitch interface
• 5 circuits / 5-pin layout
• USB 2.0 compatible structure
• LCP high-temperature thermoplastic housing
• Glass-filled UL94V-0 material
• Copper alloy contacts, t=0.15 mm
• SUS304 stainless steel shell, t=0.30 mm
• Shielded structure
• Four mounting legs for PCB retention
• Current rating: 1A max.
• Contact resistance: 30 mΩ max.
• Insulation resistance: 100 MΩ min.
• Dielectric withstanding voltage: 100V AC for 1 minute
• Operating temperature: -30°C to +80°C
• Tape & reel packaging
• RoHS compliant
Micro USB 5P Type-B receptacle right angle mid-mount SMT connector is designed for compact electronic devices that require reliable USB 2.0 power and signal connection in a low-profile PCB assembly. Based on the drawing, this connector features a Micro USB Type-B 5-pin receptacle structure with right-angle orientation, mid-mount SMT termination, and a 0.65 mm pitch interface. Its compact 5.55 mm footprint makes it suitable for space-limited circuit board designs where stable USB connection and mechanical retention are important.
The connector uses an LCP high-temperature thermoplastic housing with glass-filled material and UL94V-0 flammability rating, helping it withstand SMT reflow processing and demanding electronic assembly conditions. The contact material is copper alloy with 0.15 mm thickness, while the outer shell uses SUS304 stainless steel with 0.30 mm thickness for shielding and mechanical protection. The design also includes four mounting legs for improved PCB retention and stable positioning during soldering. With right-angle SMT mounting, mid-mount structure, tape and reel packaging, and RoHS compliance, this connector is suitable for automated PCB production and high-volume electronic manufacturing requiring a dependable Micro USB interface.
| General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MCB-CB5163-XXTR-01 | Description | Micro USB 5P Type-B Receptacle, Right Angle, Mid-Mount, SMT |
| Application | I/O Connector / Cable-to-Board | Comments | RoHS Compliant |
| Component Type | Receptacle | Product Name | Micro USB |
| USB Version | USB 2.0 | Type | Type-B |
| Keywords | Micro USB 5P, Micro USB Type-B, USB 2.0, Right Angle SMT Receptacle, Mid-Mount Connector | Circuit Application | Power & Signal |
| Electrical | |||
| Current – Maximum | 1A Max. | Grounding to Panel | Yes |
| Shielded | Yes | Shield Type | SUS304, t=0.30mm |
| Voltage – Maximum | — | Contact Resistance | 30 mΩ Max. |
| Insulation Resistance | 100 MΩ Min. | Dielectric Withstanding Voltage | 100V AC for 1 minute |
| Physical | |||
| Circuits (Loaded) | 5 | Circuits (Maximum) | 5P |
| Color – Housing | — | Durability (Mating Cycles Max) | — |
| Keying to Mating Part | Yes | Gender | Female / Receptacle |
| Material – Contact | Copper Alloy, t=0.15mm | Plating on soldering area | — |
| Material – Housing | LCP high-temperature thermoplastic, glass-filled, UL94V-0 | Connector Mounting Type | SMT |
| Mounting Style | Mid-Mount | Net Weight | — |
| Packaging Type | Tape & Reel | Orientation | Right Angle |
| PCB Retention | Yes | Vacuum Pick-up Cap | — |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -30°C to +80°C |
| Waterproof / Dustproof | — | Number of Mount legs | 4 |
| Pitch – Termination Interface | 0.65 mm | Ports | 1 |
| Termination Interface Style | SMT | PCB Thickness (Recommended) | — |
| Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
