$0.14
Mini USB 10P Right-Angle Receptacle, SMT + THT (DW-MUB-S10091) This is a Mini USB 10-pin receptacle designed for compact device interconnects. It features a right-angle, top-mount configuration with SMT signal contacts and through-hole mounting posts for strong board retention.
Highlights: Hybrid SMT + THT mounting; 0.40 mm pitch signal row; ≥5,000 cycles; −30~+80 °C operation; Au-over-Ni contact options (Flash/3/5/15/30 µin); robust nickel-plated shell; tape-and-reel.
Applications: Handheld devices, portable accessories, legacy mobile products, audio-enabled docks/adapters, test/instrumentation.
Mini USB 10P Right-Angle Receptacle, SMT + THT DW-MUB-S10091-01TR-01 is a compact, hybrid-mount connector for handheld and portable devices that still require Mini-USB I/O with audio side pins.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MUB-S10091-01TR-01 | Description | Mini USB Type-F Receptacle, SMT + DIP Hybrid, 10 Pin, Shielded |
| Application | Board-mount receptacle (I/O) | Comments | Terminal plating options: 01/03/05/15/30 (Gold on mating area); TR: Tape Reel; Series: 01–99 |
| Component Type | Receptacle | Product Name | Mini USB Type-F |
| USB Version | Right Angle | Type | Mini-USB |
| 2. Electrical | |||
| Current – Maximum | 1.0 A | Grounding to Panel | Yes (metal shell to GND pads) |
| Shielded | Yes | Shield Type | Full metal shell with boardlocks |
| Voltage – Maximum | — | Contact Resistance | 50 mΩ Max |
| Insulation Resistance | 100 MΩ Min (100 V DC) | Dielectric Withstanding Voltage | 100 V AC |
| 3. Physical | |||
| Circuits (Loaded) | 10 | Circuits (Maximum) | 10 |
| Color – Housing | Black | Durability (Mating Cycles Max) | 5,000 |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes (Mini-USB keyed shell) | Lock to Mating Part | Friction latch via shell springs |
| Material – Contact | C5210 copper alloy | Plating on soldering area | Tin on solder tails |
| Plating on contact area | Gold (per option code) | Material – Housing | LCP, UL94V-0 |
| Mounting Style | SMT + DIP Hybrid | Connector Mounting Type | Board mount |
| Number of Rows | 1 | Net Weight | — |
| Packaging Type | Tape Reel | Orientation | Horizontal |
| PCB Retention | 2 through-hole stakes (boardlocks) | Vacuum Pick-up Cap | No |
| Polarized to Mating Part | Yes | Temperature Range – Operating | −30 °C to +80 °C |
| Waterproof / Dustproof | — | Number of Mount legs | 2 |
| Pitch – Termination Interface | — | Ports | 1 |
| Termination Interface Style | SMT + DIP | PCB Thickness (Recommended) | 1.6mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150 °C | Preheat Temperature Max | Ts(max) = 200 °C |
| Preheat Time (Ts min to max) | ts = 60–120 s | Ramp-up Rate (Ts to Tp) | 3 °C/s max |
| Liquidous Temperature | TL = 217 °C | Time Above TL | tL = 60–150 s |
| Peak Package Body Temp | Tp ≤ TC (see table) | Time within 5 °C of Tp | tp = 20–30 s |
| Ramp-down Rate (Tp to TL) | 6 °C/s max | Time 25 °C to Peak Temp | 8 minutes max |
| 5. Package Classification Reflow Temperature | |||
| PB-Free Assembly — Package Thickness < 1.6 mm | 260 °C | Volume mm³ < 350 | 260 °C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260 °C | Volume mm³ 350–2000 | 250 °C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250 °C | Volume mm³ > 2000 | 245 °C |
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