Designed for compact electronics where routing space is limited, this 1.0mm pitch SMT dual row pin header delivers a stable, high-density interface with 0.30mm square brass
This 1.0mm SMT dual row pin header 1.50H is engineered for dense board layouts requiring reliable signal routing and stable solder joints in surface-mount assemblies. The drawing
1.27 mm Dual-Row SMT Pin Header, Vertical, Base 1.0 mm It features a vertical (top-entry) orientation with surface-mount terminals and a 1.0mm standoff/base for solder-paste
1.27 pin header dual rows SMT type base 1.00H with vertical 180° orientation, brass contacts, SQ0.40 terminals, PA6T+30%GF UL94V-0 insulator, 1A current rating, AC500V voltage
1.27 pin header dual rows SMT type base 1.00H with vertical 180° orientation, brass contacts, SQ0.40 terminals, PA6T+30%GF UL94V-0 insulator, 1A current rating, AC500V voltage
1.27mm E-Type SMT Male Connector with dual-row pin header design, vertical 180° orientation, H=6.7mm height, phosphor bronze contacts, Sn and Au over Ni plating, LCP UL94V-0
1.27mm Pin Header Dual Rows SMT Type Base 2.0H with Cap is a dual-row brass SMT header on 1.27mm pitch, featuring Ni/Au-plated 0.40mm posts, PA6T UL94V-0 housing and 2A per pin
The 1.27mm right angle SMT pin header is a low-profile, dual-row connector optimized for dense board stacking, offering 2A per pin, gold-plated brass contacts and a UL94V-0 LCP
1.27mm SMT dual row pin header 1.00H is built for fine-pitch board-to-board connections where space is tight and solder joint stability matters. The drawing specifies SQ0.4 ±0.02