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A rugged USB 3.0 Type-A female right-angle connector for wave-solder builds. The 90° DIP footprint and board-lock stakes keep the jack firmly seated, while gold-finished contacts and a nickel-plated shell maintain low resistance for 5 Gb/s SuperSpeed signaling. Rated 1.8 A on VBUS/GND with AC 100 V dielectric holdoff and ≥100 MΩ insulation, it endures ≥1500 insertions from −55 °C to +85 °C. Ideal for motherboards, hubs, communication equipment, and industrial devices.
Key Features at a Glance
USB 3.0 / 9-pin Type-A, 90° DIP through-hole
Board-lock stakes + shell posts for robust retention
Electrical: 1.8 A (VBUS/GND), 0.25 A others; AC 100 V/1 min, ≥100 MΩ insulation
Contact resistance ≤30/50 mΩ; durability ≥1500 cycles
Housing UL94 V-0; Au-over-Ni contacts, Ni/Gld-plated shell
Operating −55 ~ +85 °C; RoHS/REACH compliant
Highlights
Wave-solder friendly, strong mechanical anchoring, stable SuperSpeed performance, compact front outline.
Applications
Computers & laptops • Motherboards & hubs • Communication gear • Industrial automation • Data-storage devices.
USB 3.0 Type-A female right-angle connector designed for horizontal PCB mounting in PCs, hubs, and industrial controllers. This 9-pin SuperSpeed receptacle uses a 90° DIP pin field with board-lock stakes to hold position through wave solder and service use.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MU3-DA9020-XX TP-01 | Description | USB 3.0 Type-AF Female, 9PIN, Right Angle, DIP Mount, Long Body with Solder Pegs |
| Application | wire to board /Cable-to-Board | Comments | Long-body design with dual hold-down pegs, fully shielded |
| Component Type | Receptacle | Product Name | USB 3.0 Type-AF Female, 9PIN, Right Angle, DIP Mount, Long Body with Solder Pegs |
| USB Version | USB 3.0 | Type | Type-AF |
| Keywords | USB A Connector, USB 3.0 Connector, Right Angle USB Connector, 90 Degree USB, USB DIP Connector, Type-A USB, I/O Connector, USB 3.0 Female Port | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.8A (VBUS/GND), 0.25A (others) | Grounding to Panel | Yes (through shell legs) |
| Shielded | Yes | Shield Type | Full Shield Nickel/Gold Plated |
| Voltage – Maximum | 30V DC | Contact Resistance | 30mΩ (VBUS/GND), 50mΩ (Others) |
| Insulation Resistance | 100MΩ Min | Dielectric Withstanding Voltage | 100V AC |
| 3. Physical | |||
| Circuits (Loaded) | 9 | Circuits (Maximum) | 9PIN |
| Color – Housing | Black | Durability (Mating Cycles Max) | 1,500 Cycles |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | Yes |
| Material – Contact | C5191 + C2680 Copper Alloy | Plating on soldering area | Tin 100μ” |
| Plating on contact area | Gold Flash | Material – Housing | UL94V-0 High Temp Plastic |
| Mounting Style | DIP (Through-Hole) | Connector Mounting Type | Board Mount |
| Number of Rows | 2 (inner & outer contact rows) | Net Weight | – |
| Packaging Type | Tray Packing | Orientation | Right Angle / Horizontal |
| PCB Retention | Yes (hook-type) | Vacuum Pick-up Cap | No |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -55°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 2 pegs + 9 signal pins |
| Pitch – Termination Interface | 2.50 mm | Ports | 1 |
| Termination Interface Style | RIGHT ANGLE | PCB Thickness (Recommended) | 1.6 mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| PB-Free Thickness <1.6 mm | Volume <350mm³: 260°C | Volume 350–2000mm³: 260°C | Volume >2000mm³: 260°C |
| PB-Free Thickness 1.6–2.5 mm | Volume <350mm³: 260°C | Volume 350–2000mm³: 250°C | Volume >2000mm³: 245°C |
| PB-Free Thickness >2.5 mm | Volume <350mm³: 250°C | Volume 350–2000mm³: 245°C | Volume >2000mm³: 245°C |
| Lead-Free Process Type | Reflow | Reflow | Reflow |
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