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USB Type-C 6-pin female connector – Compact Right-Angle SMT – power and CC negotiation in a minimal footprint ideal for compact devices. A right-angle SMT body simplifies reflow and front-panel alignment, while the nickel-plated shell and reinforced pads improve retention under cable load. CC1/CC2, VBUS, and GND are the only active pins, streamlining routing for 5 V/3 A power paths, docking cradles, and accessories. Rated for 5,000 mating cycles and −40 °C to +85 °C operation, it provides dependable connectivity for wearables, power banks, and embedded IoT designs.
Key Features at a Glance
Right-angle SMT Type-C receptacle; low-profile housing
6-pin implementation: CC1/CC2, VBUS, GND
3.0 A max @ 5 V; dielectric withstand 100 VAC/1 min
Contact resistance: ≤40 mΩ (A5/A9/B5/B9), ≤70 mΩ (A12/B12)
5,000 cycles durability; mating/unmating 5–20 N / 2–20 N
Materials: LCP UL94V-0 housing, copper-alloy contacts, nickel-plated shell
Operating −40 °C to +85 °C; RoHS/REACH compliant; TR = Tape & Reel
Highlights
Compact Type-C power/CC solution; simplified routing vs. 24-pin; robust shell and pad design for reliable retention; ideal for high-volume reflow.
Applications
Smart wearables • Portable power banks • IoT modules & accessories • Medical/diagnostic handhelds • Consumer electronics and embedded devices needing 5 V/3 A Type-C power
USB Type-C 6-pin female connector – Compact Right-Angle SMT for space-constrained board-edge I/O where power and basic CC signaling are required without the full 24-pin stack. This right-angle, surface-mount receptacle uses a low-profile housing with a compact footprint for reflow assembly.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-MUB-CF006326-06TR-03 | Description | USB Type-C Receptacle, 6PIN, SMT Type, Mid-Mount, Height 6.80mm |
| Application | Wire-to-Board /Cable-to-Board | Comments | RoHS Compliant |
| Component Type | Receptacle | Product Name | USB Type-C |
| USB Version | USB Type-C Gen 1 | Type | Type-C |
| Keywords | USB Type-C Connector, USB Type-C Receptacles, TYPE C connector, USB-C connector, I/O Connector, SMT Type, Surface-mount USB-C jack | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 3.0A Max | Grounding to Panel | Yes |
| Shielded | Yes | Shield Type | Nickel-Plated Copper Alloy Shell |
| Voltage – Maximum | 5V Max | Contact Resistance | ≤40mΩ (A5/B5/B9), ≤70mΩ (A12/B12) |
| Insulation Resistance | ≥100MΩ | Dielectric Withstanding Voltage | 100V AC for 1 Minute |
| 3. Physical | |||
| Circuits (Loaded) | 6 | Circuits (Maximum) | 6P |
| Color – Housing | Black | Durability (Mating Cycles Max) | 5000 Cycles |
| Keying to Mating Part | Yes | Gender | Female / Receptacle |
| Material – Contact | Copper Alloy, Gold Plated | Plating on soldering area | Gold Flash to 30μ” |
| Material – Housing | LCP UL94V-0 | Connector Mounting Type | SMT |
| Mounting Style | Mid-Mount SMT | Net Weight | – |
| Packaging Type | Tape & Reel | Orientation | Right Angle |
| PCB Retention | Yes | Vacuum Pick-up Cap | – |
| Polarized to Mating Part | Yes | Temperature Range – Operating | -40°C to +85°C |
| Waterproof / Dustproof | No | Number of Mount legs | 4 |
| Pitch – Termination Interface | 0.80 mm | Ports | 1 |
| Termination Interface Style | Right Angle | PCB Thickness (Recommended) | 0.8mm |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness < 1.6 mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | 250°C | 245°C |
| PB-Free Assembly — Package Thickness > 2.5 mm | 250°C | 245°C | 245°C |
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