$0.08
1.25mm Wire to Board Wafer
1.25mm Wire to Board Wafer vertical SMT, single row (2–30 circuits) designed to mate with crimp housings. SMT gull-wing terminals with end hold-downs provide strong solder joints. This Single Row SMT Wafer supports 2–30 circuits and uses SMT hold-downs for robust reflow retention. Recommended PCB layout: 1.25 ± 0.05 mm pad pitch, 0.60 ± 0.05 mm pad width (see drawing). Low body height ~4.05 mm suits dense assemblies. Electrical ratings: 1 A/contact, 50 V AC/DC; contact resistance ≤ 30 mΩ; insulation resistance ≥ 100 MΩ; dielectric withstand 500 VAC/min. Operating temp −25 °C to +85 °C. Materials: PA6T/LCP UL94V-0 insulator; phosphor-bronze contacts; Tin plating. RoHS compliant; supplied in tape-and-reel.
APPLICATION: Consumer electronics, IoT modules, lighting bars, small appliances, industrial controllers
PPRODUCTS HIGHLIGHT: Fine-pitch 1.25 mm vertical header for compact harnesses
SMT + hold-downs for robust retention during reflow
Multiple gold thickness options to balance cost and life
1.25mm Wire to Board Wafer (right angle, Surface mount, single row). 1 A/contact, 50 V, −25°C~+85°C, tin-plated contacts, PA6T/LCP UL94V-0
| General | |||
| Status | Active | Category | Wire to board (WTB) connectors |
| Series | Wire-to-Board Header | Description | 1.25 mm Wafer, Single Row, SMT |
| Part Number | DW-WF-1125218WR02P-31TR-01 | Comments | Insulator: PA6T/LCP UL 94V-0 |
| Component Type | PCB Receptacle (Wafer) | Product Name | Wafer Connector |
| Electrical | |||
| Current – Maximum per Contact | 1 A AC/DC | Voltage – Maximum | 50 V AC/DC |
| Insulation Resistance | 100 MΩ Min. | Withstanding Voltage | 500 V AC/minute |
| Contact Resistance | 30 mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 2-30 Pins | Circuits (maximum) | 30 |
| Color – Resin | PA6T/LCP UL 94V-0 | Durability (mating cycles max) | 30 |
| Glow-Wire Capable | yes | Lock to Mating Part | N/A |
| Mated Height | 4.25 mm | Mated Width | 4.25 mm |
| Material – Metal | Phosphor Bronze | Material – Plating Mating | Tin |
| Material – Plating Termination | Tin | Net Weight | _ |
| Number of Rows | 1 | Orientation | N/A |
| Packaging Type | Tape Reel (TR) | Termination Interface Style | Surface Mount |
| Temperature Range – Operating | −25 °C to +85 °C | Pitch – Mating Interface | 1.25 mm |
| Weight | 5 kg |
|---|---|
| Dimensions | 35 × 35 × 35 cm |
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