$0.00
1.8mm vertical THT wafer header — a single-row, crimp-style through-hole connector for matching housings. It uses two signal pins with molded board-locks/polarizing bosses for secure retention through wave solder and cable pull, while delivering 3.0 A, 250 V rating and 1000 V AC dielectric strength across −25 ~ +85 °C.
Key Features at a Glance
1.8 mm pitch, single row; vertical through-hole
Board-locks/polarizing bosses for strong retention
PCB layout: Ø1.00 mm terminal holes; Ø0.80 mm boss holes; span ~4.20–4.40 mm
Electrical: 3.0 A, 250 V, ≤30 mΩ contact, ≥1000 MΩ insulation, 1000 V AC/1 min withstand
Materials: tin-plated brass contacts; LCP UL94V-0 housing
RoHS/REACH compliant
Highlights
Crimp-style interface for fast harness build; polarized, service-friendly mating; robust THT barrels for shock and vibration.
Applications
Consumer electronics • IoT modules • LED lighting • Small appliances • Battery packs • Control boards.
.8mm vertical THT wafer header for crimp-housing terminations that need strong board retention and easy mating. This single-row, through-hole connector includes two signal pins plus molded board-locks/polarizing bosses that stabilize the part during wave solder and cable pulls.
| General | |||
| Status | Active | Category | Wafer |
| Product Name | Wafer Connector | Description | 1.80 mm Pitch Crimp Style Wafer (SMT) |
| Part Number | DW-WF-1180123WV02P-31TR-XX | Component Type | Wafer (SMT) |
| Electrical | |||
| Current – Maximum per Contact | 3.0 A AC/DC | Voltage – Maximum | 250 V AC/DC |
| Insulation Resistance | 1000 MΩ Min. | Withstanding Voltage | 1000 V AC / minute |
| Contact Resistance | 30 mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 02 (per PN “02P”) | Circuits (maximum) | |
| Color – Resin | Insulator color options: 01 Black / 02 Natural / 03 Yellow / 04 Red | Durability (mating cycles max) | |
| Glow-Wire Capable | _ | Lock to Mating Part | Yes (keyed housing) |
| Mated Height | _ | Mated Width | _ |
| Material – Metal | Brass | Material – Plating Mating | Tin-plated (option code 31) |
| Material – Plating Termination | Tin-plated | Net Weight | _ |
| Material – Resin | LCP, UL 94V-0 | Material – Shell | _ |
| Number of Rows | 1 (Single Row) | Orientation | Vertical (180°) (WV) |
| Packaging Type | Tape & Reel (TR) | PCB Locator | _ |
| PCB Retention | Yes — 4 SMT hold-down pads (per PCB layout) | Pitch – Mating Interface | 1.80 mm |
| Pitch – Termination Interface | 1.80 mm | Plating min – Mating | Tin (31 option); other options available 01/03/06/15/30/32 |
| Polarized to Mating Part | Yes (notch) | Polarized to PCB | _ |
| Temperature Range – Operating | −25 °C to +85 °C | Termination Interface Style | Surface Mount |
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