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2.00mm Pitch Vertical Dual Row Wafer

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2.00mm pitch vertical dual row wafer for compact wire-to-board PCB connection, featuring a dual-row through-hole design, Nylon 46 UL94V-0 insulator, and brass terminals with tin over nickel plating. This 2.00mm dual row wafer connector is ideal for stable vertical PCB connection in fine-pitch electronic assemblies.

Product Applications
Wire-to-board connection, consumer electronics, industrial control boards, compact power modules, signal transmission assemblies, home appliances, PCB connection systems, embedded electronic devices

Product Highlights
2.00mm pitch, vertical dual row wafer, through hole DIP mounting, available from 04P to 40P, 3A AC/DC current rating, 250V AC/DC voltage rating, 1000V AC/minute withstanding voltage, 1000MΩ minimum insulation resistance, 30mΩ maximum contact resistance, brass terminals with tin over nickel plating, Nylon 46 UL94V-0 ivory insulator, PIN 0.50 SQ, PE bag or TP tray packing options

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Description

2.00mm pitch vertical dual row wafer is designed for compact wire-to-board PCB connection where stable mating, reliable soldering, and efficient use of board space are important. This 2.00mm dual row wafer connector uses a vertical structure with dual-row terminal arrangement and through-hole DIP mounting, making it a dependable choice for control boards, consumer electronics, and compact power or signal assemblies. As a 2.00mm vertical wafer connector, it supports organized harness connection and secure board installation for applications that need a fine-pitch dual-row interface. The drawing confirms a 2.00mm pitch vertical dual row wafer structure with 04 to 40 circuits, 3A AC/DC current rating, 250V AC/DC voltage rating, 30mΩ max contact resistance, 1000MΩ minimum insulation resistance, and 1000V AC/minute withstanding voltage.

This dual row wafer DIP connector is built with brass terminals with tin over nickel plating and a Nylon 46, UL94V-0 ivory insulator, giving the connector reliable conductivity and practical durability for routine PCB assembly use. As a 2.00mm PCB wafer connector, it is suitable for vertical board connection in equipment that needs stable insertion and dependable electrical contact. The drawing also shows PIN 0.50 SQ, 2.00mm pitch, and a recommended PCB layout with Ø0.80±0.05 terminal holes, which helps this 2.00mm dual row through hole wafer deliver accurate PCB positioning and consistent soldering performance.

For product selection, this 2.00mm wire to board wafer series is available in multiple circuit sizes from 04P to 40P. The part number information shows WV for vertical orientation, plating code options including gold flash, 3u gold, 6u gold, 15u gold, 30u gold, Sn, and Ni, plus packaging options such as PE bag and TP tray packing. That makes this vertical dual row PCB connector a practical solution for different assembly and packaging requirements. Whether used as a 2.00mm wafer connector DIP in signal connection or compact power layouts, it offers a reliable vertical dual-row connection platform for many electronic products.

General
Status N/A Category Wafer
Product Name Wafer Connector Description 2.00mm Pitch Vertical Dual Row Wafer
Part Number DW-WF-2200388WVnP-31XX-01 Component Type Wafer (DIP)
Electrical
Field Value Field Value
Current – Maximum 3A AC/DC Voltage – Maximum 250V AC/DC
Insulation Resistance Min. 1000MΩ Min. Withstanding Voltage 1000V AC/minute
Contact Resistance 30mΩ Max.
Physical
Circuits (Loaded) 04P-40P Circuits (maximum) 40
Color – Resin Ivory Durability (mating cycles max) N/A
Glow-Wire Capable N/A Lock to Mating Part N/A
Mated Height 8.70±0.25 mm Mated Width Per table: 04=6.00 mm; 06=8.00 mm; 08=10.00 mm; 10=12.00 mm; 12=14.00 mm; 14=16.00 mm; 16=18.00 mm; 18=20.00 mm; 20=22.00 mm; 22=24.00 mm; 24=26.00 mm; 26=28.00 mm; 28=30.00 mm; 30=32.00 mm; 32=34.00 mm; 34=36.00 mm; 36=38.00 mm; 38=40.00 mm; 40=42.00 mm
Material – Metal Brass Material – Plating Tin over Nickel
Material – Plating Thickness Per code: 01 Gold Flash / 03 3u Gold / 06 6u Gold / 15 15u Gold / 30 30u Gold / 31 Sn / 32 Ni Net Weight N/A
Material – Resin Nylon 46, UL94V-0 Material – Shell N/A
Number of Rows 2 (Dual Row) Orientation Vertical
Packaging Type Per code: PE Bag / TP: Tray Packing PCB Locator N/A
PCB Retention N/A Pitch – Mating Interface 2.00 mm
Pitch – Termination 2.00 mm Plating min – Mating N/A
Polarized to Mating Part N/A Polarized to PCB N/A
Temperature Range -25 °C to +85 °C Termination Interface Through Hole

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