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2.50mm vertical THT wafer header – Reliable Single-Row, Polarized Wafer delivers a familiar, service-friendly interface for crimp housings. Polarized entry prevents mis-mating, while round pins and Ø0.90 mm holes form strong solder barrels for dependable field life. Brass terminals with tin over nickel keep contact resistance low, and optional gold on the mating area lets you tune durability for frequent cycles. Rated 3 A, 250 V with 1000 V AC dielectric and −25 to +85 °C operation, it fits power/control boards, appliances, and LED assemblies where a standard 2.50 mm footprint simplifies layout and assembly.
Key Features at a Glance
2.50 mm pitch, single row, vertical (180°)
THT pins with Ø0.90 mm recommended hole size
Dimensions: overall height ~7.10 mm; front height ~4.20 mm; depth ~5.80 mm
Electrical: 3 A, 250 V, ≤20 mΩ contact, ≥1000 MΩ insulation, 1000 V AC/1 min withstand
Materials: brass pins, tin over nickel; PA46 UL94V-0 housing
Finish options: Gold Flash / 3 / 6 / 15 / 30 µin Au; Sn/Ni variants
RoHS compliant; PE-bag packaging
Highlights
Industry-standard footprint with keyed polarization; rugged through-hole joints; flexible plating options to match lifecycle and cost.
Applications
Power/control boards • Consumer electronics • Appliances • Lighting modules • Industrial controllers.
2.50mm vertical THT wafer header for wire-to-board links that need robust through-hole retention and an industry-standard footprint. This single-row, 180° vertical wafer uses round pins on a 2.50 ±0.10 mm pitch with a polarized end for keyed mating.
| General | |||
| Status | Active | Category | Wafer, single-row DIP header |
| Product Name | Wafer Connector | Description | 2.50 mm Pitch Wafer, Single Row, DIP Type |
| Part Number | DW-WF-1250566WVNP-31PE-01 | Component Type | Wafer, wire-to-board header |
| Electrical | |||
| Field | Value | Field | Value |
| Current – Maximum per Contact | 3 A AC/DC | Voltage – Maximum | 250 V AC/DC |
| Insulation Resistance | 1000 MΩ Min. | Withstanding Voltage | 1000 V AC/minute |
| Contact Resistance | 20 mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 2–20 (per table) | Circuits (maximum) | 20 |
| Color – Resin | _ | Durability (mating cycles max) _ | |
| Glow-Wire Capable | Lock to Mating Part | ||
| Mated Height | 4.20 ±0.20 mm | Mated Width | B per table (mm): 02→6.10; 03→8.60; 04→11.10; 05→13.60; 06→16.10; 07→18.60; 08→21.10; 09→23.60; 10→26.10; 11→28.60; 12→31.10; 13→33.60; 14→36.10; 15→38.60; 16→41.10; 17→43.60; 18→46.10; 19→48.60; 20→51.10 |
| Material – Metal | Brass | Material – Plating Mating | Tin over Nickel |
| Material – Plating Termination | Tin over Nickel | Net Weight | _ |
| Material – Resin | PA46, UL94V-0 | Material – Shell | |
| Number of Rows | 1 (Single Row) | Orientation | Vertical (WV) |
| Packaging Type | PE Bag (PE) | PCB Locator | |
| PCB Retention | Through-hole pins; pin size 0.64 ±0.05 mm; PCB holes Ø0.9 mm | Pitch – Mating Interface | 2.50 mm |
| Pitch – Termination Interface | 2.50 mm | Plating min – Mating | Per code options (01 Gold Flash / 03 3 µin Au / 06 6 µin Au / 15 15 µin Au / 30 30 µin Au / 31 Sn / 32 Ni) |
| Polarized to Mating Part | Polarized to PCB | ||
| Temperature Range – Operating | −25 °C to +85 °C | Termination Interface Style | Through Hole (DIP) |
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