2.54 pitch pin header dual row H2.0mm DIP header with vertical 180° orientation, brass contacts, 0.64 SQ terminals, PA6T UL94V-0 insulator, 3.0A current rating, 1000V AC withstand voltage, PE bag packaging, and RoHS compliance.
• Applications: Board-to-board PCB connection, signal interface boards, industrial control boards, embedded electronics, communication equipment, automation modules, power control boards, instrumentation, consumer electronics, and through-hole PCB assembly.
• Highlights: 2.54 pitch pin header dual row H2.0mm DIP header; vertical 180° orientation; through-hole / DIP mounting; dual row structure; brass contacts; 0.64 SQ terminal; 3.0A rated current; 1000V AC withstand voltage; 1000MΩ min insulation resistance; 20mΩ max contact resistance; PA6T UL94V-0 insulator; 5.25±0.35mm PC tail length; 2.00±0.15mm body/base height; 5.00±0.15mm housing width; Ø1.02mm recommended PCB hole; Au or Sn over Ni plating; PE bag packaging; 260°C ±5°C soldering heat for 10s; RoHS compliant.
2.54 pitch pin header dual row H2.0mm DIP header DW-PH-2254859WVnP-XXPE-01 is a vertical through-hole PCB connector designed for reliable board-to-board and signal connection applications. Based on the drawing title, this product is a 2.54 pitch pin header with dual row structure, H2.0mm DIP type base, vertical 180° orientation, and PE bag packaging.
This 2.54 pitch pin header dual row H2.0mm DIP header uses brass contacts with a 0.64 SQ terminal structure for stable PCB connection. The connector supports a rated current of 3.0A, 1000MΩ minimum insulation resistance, 20mΩ maximum contact resistance, and 1000V AC withstand voltage. These specifications make it suitable for signal transfer, board-level interconnection, control boards, embedded electronics, and general PCB assembly.
The insulator material is PA6T, UL94V-0, supporting flame-retardant performance for electronic assemblies. The drawing confirms 2.54mm pitch, 2.54mm row-to-row pitch, 0.64 SQ post, 5.25±0.35mm PC tail length, 2.00±0.15mm body/base height, 5.00±0.15mm housing width, and Ø1.02mm recommended PCB hole diameter. The operating temperature range is -40°C to +105°C.
The part number supports plating options including 01 Gold Flash, 03 3u” Gold, 06 6u” Gold, 15 15u” Gold, 30 30u” Gold, 31 Sn, and 32 Ni. With Au or Sn over Ni plating, RoHS compliance, and 260°C ±5°C soldering heat resistance for 10 seconds, this 2.54 pitch pin header dual row H2.0mm DIP header is suitable for manufacturers requiring a reliable through-hole PCB mount header.
| General | |||
| Status | Active | Category | PCB Headers and Receptacles |
| Series | DW-PH-2254859WVnP-XXPE-01 | Description | 2.54 Pitch Pin Header Dual Row H2.0mm DIP Header |
| Application | Board-to-Board | Component Type | Connector Assembly |
| PCB Connector Type | PCB Mount Header | Product Name | Pin Header CONN |
| Keywords | 2.54 Pin Header, Dual Row Pin Header, DIP Header, Through Hole Header | Contact Type | Pin |
| Electrical | |||
| Rated Voltage | N/A | Current Rating | 3.0A |
| Contact Resistance | 20mΩ Max. | Insulation Resistance | 1000MΩ Min. |
| Dielectric Withstand | 1000V AC | Norm | N/A |
| Physical | |||
| Breakaway | N/A | Circuits / Number of Positions | Variable nP |
| Circuits Maximum | N/A | Color – Housing | N/A |
| Durability / Mating Cycles | N/A | Flammability | UL94V-0 |
| Glow-Wire Capable | N/A | Lock to Mating Part | N/A |
| Material – Metal | Brass | Material – Plating | Au or Sn over Ni |
| Material – Plating Solder | N/A | Material – Resin | PA6T, UL94V-0 |
| Metal Shape and Form | 0.64 SQ | Number of Rows | 2 |
| Connector Orientation | Vertical / 180° | Packaging Type | PE Bag |
| PCB Locator | N/A | PCB Retention | N/A |
| PC Tail Length | 5.25±0.35mm | Pitch – Mating Interface | 2.54mm |
| Plating Min – Mating | See part number code | Plating Min – Termination | N/A |
| Polarized to Mating Part | N/A | Polarized to PCB | N/A |
| Shrouded | No | Stackable | N/A |
| Operating Temperature | -40°C to +105°C | Termination Interface | Through Hole |
| Square Terminal Post | 0.64 SQ | PCB Mount Retention | N/A |
| PCB Mount Alignment | N/A | Connector Mounting | Through Hole / DIP |
| PCB Thickness Recommended | N/A | Row-to-Row Pitch | 2.54mm |
| Height of Connector | N/A | Recommended PCB Hole Dia. | Ø1.02mm |
| Body Height / Base Height | 2.00±0.15mm | Housing Width | 5.00±0.15mm |
| Solder Process Data | |||
| Max-Cycle | N/A | Max-Duration | 10s |
| Lead-Free Process Compatible | Yes (RoHS Compliant) | Max-Temp | 260°C±5°C |
