The 2.54mm dual-insulator THT header DW-PH-2254869 series is a dual-row vertical PCB pin header featuring two 2.0 mm insulator sections, 0.64 mm square brass contacts, PA6T UL94 V-0 insulation and a 3 A current rating. It provides configurable pin counts, multiple contact-plating options and PE-bag packaging for flexible board-level interconnection.
2.54mm dual-insulator THT header DW-PH-2254869WVnP-XXPE-01 is a dual-row vertical pin header designed for through-hole PCB interconnection. The supplied Dragon Well engineering drawing confirms a 2.54 mm contact pitch, dual-row construction and a distinctive dual-insulator design using two 2.0 mm-high housing sections. This configuration provides a structured pin arrangement for board-level interconnection and applications requiring extended contacts on both sides of the connector body.
The connector uses 0.64 mm square brass contacts and a PA6T insulating housing rated UL94 V-0. The two contact rows are spaced at 2.54 mm, matching the longitudinal contact pitch. The drawing specifies approximately 4.00 ± 0.35 mm exposed contact length above the housing and 4.00 ± 0.35 mm below the housing, while the combined dual-insulator body height is approximately 4.00 ± 0.35 mm.
Electrical performance of this 2.54mm dual-insulator THT header includes a 3.00 A rated current, 20 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 1000 VAC withstand voltage. The specified operating-temperature range is −40°C to +105°C.
Contact plating is specified as gold or tin over nickel, depending on the selected ordering code. Available drawing-defined options include Gold Flash, 3 µin Gold, 6 µin Gold, 15 µin Gold, 30 µin Gold, tin and nickel. The exact plating should therefore be selected through the XX portion of the product number rather than assuming one finish for the complete family.
The connector is specified to withstand soldering heat of 260°C ±5°C for up to 10 seconds and is supplied in PE-bag packaging for this model configuration. The 2.54mm dual-insulator THT header is RoHS compliant and is suitable for PCB interconnection, elevated board connections and board-stacking applications where a traditional 2.54 mm dual-row through-hole interface is required. Samtec similarly uses dual-insulator through-hole headers for configurable board-stacking heights, while Amphenol positions 2.54 mm dual-row headers for board-to-board applications.
| General | |||
| Status | Active | Category | PCB Headers and Receptacles |
| Series | DW-PH-2254869WVnP-XXPE-01 | Description | 2.54 Pitch Pin Header Dual Rows DIP Type Base 2.00H |
| Application | Signal / Board-to-Board | Component Type | Connector Assembly |
| PCB Connector Type | PCB Mount Header | Product Name | Pin Header CONN |
| Keywords | 2.54 Pin Header, Dual Row Pin Header, DIP Header, Through Hole Header, Vertical Header | Contact Type | Pin |
| Electrical | |||
| Rated Voltage | N/A | Current Rating | 3.0A |
| Contact Resistance | 20mΩ Max. | Insulation Resistance | 1000MΩ Min. |
| Dielectric Withstand | 1000V AC | Norm | RoHS Compliant |
| Physical | |||
| Breakaway | N/A | Circuits / Number of Positions | Variable, XXP |
| Circuits Maximum | N/A | Color – Housing | N/A |
| Durability / Mating Cycles | N/A | Flammability | UL94V-0 |
| Glow-Wire Capable | N/A | Lock to Mating Part | N/A |
| Material – Metal | Brass | Material – Plating | Au or Sn Over Ni |
| Material – Plating Solder | N/A | Material – Resin | PA6T, UL94V-0 |
| Metal Shape and Form | SQ0.64 | Number of Rows | 2 |
| Connector Orientation | Vertical / 180° | Packaging Type | PE Bag |
| PCB Locator | N/A | PCB Retention | N/A |
| PC Tail Length | 4.00±0.35mm | Pitch – Mating Interface | 2.54mm |
| Plating Min – Mating | See part number code | Plating Min – Termination | N/A |
| Polarized to Mating Part | N/A | Polarized to PCB | N/A |
| Shrouded | No | Stackable | N/A |
| Operating Temperature | -40°C to +105°C | Termination Interface | Through Hole |
| Square Terminal Post | SQ0.64 | PCB Mount Retention | N/A |
| PCB Mount Alignment | N/A | Connector Mounting | Through Hole / DIP |
| PCB Thickness Recommended | N/A | Row-to-Row Pitch | 2.54mm |
| Height of Connector | 12.00mm | Recommended PCB Hole Dia. | Ø1.02mm |
| Solder Process Data | |||
| Max-Cycle | N/A | Max-Duration | 10s Max |
| Lead-Free Process Compatible | Yes (RoHS Compliant) | Max-Temp | 260°C±5°C |
