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3.00mm pitch 180 degree single row wafer DIP connector for reliable wire-to-board PCB connection, featuring through hole mounting, LCP UL94V-0 black housing, and brass terminals with tin over nickel plating.
Product Applications
Wire-to-board connection, consumer electronics, home appliances, industrial control boards, power supply modules, LED lighting products, signal transmission assemblies, PCB power connection
Product Highlights
3.00mm pitch, single row wafer connector, vertical 180 degree design, through hole DIP mounting, available from 02P to 24P, 6A AC/DC current rating, 250V AC/DC voltage rating, 1500V AC/minute withstanding voltage, 1000MΩ minimum insulation resistance, 10mΩ maximum contact resistance, brass terminals with tin over nickel plating, LCP UL94V-0 black housing, operating temperature -25°C to +85°C
3.00mm pitch 180 degree single row wafer DIP is designed for stable wire-to-board connection in compact PCB assemblies that require secure mating, reliable soldering, and consistent electrical performance. This 3.00mm single row wafer connector uses a vertical 180° design and through hole termination, making it a dependable choice for power and signal connection in consumer electronics, industrial control products, and small appliance boards. As a 3.00mm vertical wafer connector, it offers a simple and space-efficient header structure for applications that need easy harness insertion and firm PCB retention.
This 3.00mm DIP wafer connector features a single row layout with 3.00mm pitch, available from 02P to 24P, and the drawing shows matching product outlines from 2P up to 12P together with the dimension table for the full series. As a single row through hole wafer connector, it uses a recommended PCB layout with Ø1.20 terminal holes and Ø2.40 locating hole, helping improve mounting accuracy on the board. This 3.00mm PCB wafer connector also includes a locking structure to support secure mating and stable connection during use.
Built as a reliable 3.00mm wire to board wafer, the connector is rated 6A AC/DC and 250V AC/DC, with 1000MΩ minimum insulation resistance, 1500V AC/minute withstanding voltage, and 10mΩ maximum contact resistance. The drawing specifies brass terminals with tin over nickel plating and LCP UL94V-0 black housing, supporting dependable performance in everyday electronic applications. This 180 degree wafer connector is suitable for designs that need vertical board connection, and the 3.00mm wafer connector DIP structure provides practical through hole assembly for durable PCB installation.
| General | |||
| Status | N/A | Category | Wafer |
| Product Name | Wafer Connector | Description | 3.00 Pitch 180° Single Row Wafer Dip |
| Part Number | DW-WF-1300620WNP-XXPE-01 | Component Type | Wafer (DIP) |
| Electrical | |||
| Current – Maximum | 6A AC/DC | Voltage – Maximum | 250V AC/DC |
| Insulation Resistance Min. | 1000MΩ Min. | Withstanding Voltage | 1500V AC/Minute |
| Contact Resistance | 10mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 02P-24P | Circuits (maximum) | 24 |
| Color – Resin | Black | Durability (mating cycles max) | N/A |
| Glow-Wire Capable | N/A | Lock to Mating Part | Yes |
| Mated Height | 9.90 mm | Mated Width | Per table: 02=9.60 mm; 04=12.60 mm; 06=13.80 mm; 08=18.00 mm; 10=22.20 mm; 12=26.40 mm; 14=30.60 mm; 16=34.80 mm; 18=39.00 mm; 20=43.20 mm; 22=47.40 mm; 24=51.60 mm |
| Material – Metal | Brass | Material – Plating | Brass / Tin over Nickel |
| Material – Plating Thickness | Per code: 01 Gold Flash / 03 3u Gold / 06 6u Gold / 15 15u Gold / 30 30u Gold / 31 Sn / 32 Ni | Net Weight | N/A |
| Material – Resin | LCP UL94V-0 | Material – Shell | N/A |
| Number of Rows | 1 (Single Row) | Orientation | Vertical (180°) |
| Packaging Type | PE Bag | PCB Locator | Yes |
| PCB Retention | Yes | Pitch – Mating Interface | 3.00 mm |
| Pitch – Termination | 3.00 mm | Plating min – Mating | N/A |
| Polarized to Mating Part | Yes | Polarized to PCB | N/A |
| Temperature Range | -25 °C to +85 °C | Termination Interface | Through Hole |
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