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3.00mm Pitch 180° Dual Row Wafer Connector, THT/Through-Hole

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3.00mm pitch 180° dual row wafer connector for wire-to-board PCB connection, designed with a vertical mating structure and through-hole termination for secure board mounting. This connector supports 2 to 24 pins, 5A AC/DC, and 250V AC/DC, with brass terminals, tin-over-nickel plating, and a Nylon 66 UL94V-0 housing. The drawing also shows Type 1, Type 2, and Type 3 structural versions for flexible PCB design needs.

• Applications: Household appliances, power supply boards, industrial control systems, consumer electronics, internal wire-to-board connection, control modules, PCB power and signal interconnection.

• Highlights: 3.00 mm pitch dual row wafer; 180° vertical type; through-hole/THT mounting; 2 to 24 pins available; 5A AC/DC current rating; 250V AC/DC voltage rating; brass terminals with tin over nickel plating; Nylon 66 UL94V-0 insulator; 1500V AC/min withstand; RoHS compliant; available in Type 1, Type 2, and Type 3 structures.

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Description

3.00mm pitch 180° dual row wafer connector is a through-hole PCB connector designed for stable wire-to-board connection in power and signal applications. Based on the drawing, this dual row wafer features a 3.00 mm pitch layout, 180° vertical mating structure, and supports multiple circuit counts from 2 to 24 pins. It is suitable for PCB assemblies that require dependable retention, compact dual-row contact arrangement, and consistent electrical performance.

This 3.00mm pitch 180° dual row wafer connector is rated for 5A AC/DC current and 250V AC/DC voltage, making it suitable for a wide range of consumer electronics, industrial control, and power distribution applications. The drawing also shows a contact resistance of 10mΩ max, insulation resistance of 1000MΩ min, and withstanding voltage of 1500V AC/minute, supporting reliable insulation and electrical stability in demanding operating environments. The operating temperature range is -40°C to +105°C.

The contact material is specified as brass with tin over nickel plating, while the insulator is Nylon 66, UL94V-0, helping provide durability and flame resistance for PCB connector applications. This dual row wafer connector is a practical choice for manufacturers looking for a dependable through-hole wire-to-board connector for appliances, industrial devices, control boards, and internal power or signal connection systems. It is also RoHS compliant.

General
Status Active Category Wafer
Product Name Wafer Connector Description 3.00MM PITCH 180° DUAL ROW WAFER
Part Number DW-WF-2300201WVnP-XXXX-XX Component Type Wafer (DIP)
Electrical
Current – Maximum 5A AC/DC Voltage – Maximum 250V AC/DC
Insulation Resistance Min. 1000MΩ Min. Withstanding Voltage 1500V AC/minute
Contact Resistance 10mΩ Max.
Physical
Circuits (Loaded) 02P-24P Circuits (maximum) 24
Color – Resin N/A Durability (mating cycles max) N/A
Glow-Wire Capable N/A Lock to Mating Part Yes
Mated Height Per series: Type 1=11.00±0.35 mm; Type 2=11.00±0.35 mm; Type 3=9.90±0.35 mm Mated Width Per table: 02=6.65 mm; 04=9.65 mm; 06=12.65 mm; 08=15.65 mm; 10=18.65 mm; 12=21.65 mm; 14=24.65 mm; 16=27.65 mm; 18=30.65 mm; 20=33.65 mm; 22=36.65 mm; 24=39.65 mm
Material – Metal Brass Material – Plating Tin over Nickel
Material – Plating Thickness Per code: 01 Gold Flash / 03 3u Gold / 06 6u Gold / 15 15u Gold / 30 30u Gold / 31 Sn / 32 Ni Net Weight N/A
Material – Resin Nylon 66, UL94V-0 Material – Shell N/A
Number of Rows 2 (Dual Row) Orientation Vertical (180°)
Packaging Type N/A PCB Locator Per series: Type 1/Type 2=Yes; Type 3=N/A
PCB Retention N/A Pitch – Mating Interface 3.00 mm
Pitch – Termination 3.00 mm Plating min – Mating N/A
Polarized to Mating Part Yes Polarized to PCB Per series: Type 1/Type 2=Yes; Type 3=N/A
Temperature Range -40 °C to +105 °C Termination Interface Through Hole

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