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Compact 3.00mm pitch 90 degree dual row DIP wafer connector for wire-to-board connection, featuring through hole PCB mounting, black PA66 housing, and brass tin-plated contacts.
Product Applications
Wire-to-board connection, industrial control boards, power supply modules, home appliances, consumer electronics, automotive electronics, PCB power connection, signal transmission assemblies
Product Highlights
3.00mm pitch, dual row wafer connector, right angle 90 degree design, through hole DIP termination, pin 0.64 square, 5.0A AC/DC rating, 250V AC/DC voltage rating, 1500V AC withstand voltage, brass tin-plated contacts, PA66 housing, black color, polarized mating, available from 2x1P to 2x12P
3.00mm pitch 90 degree dual row DIP wafer connector is designed for stable wire-to-board connection in power and signal applications where secure mating, reliable PCB retention, and compact right angle mounting are required. This 3.00mm right angle wafer connector uses a dual row structure and through hole DIP termination, making it a practical dual row DIP wafer connector for board assemblies that need dependable soldering strength and organized cable connection. As a 3.00mm PCB wafer connector, it is suitable for control boards, power interface modules, home appliances, and industrial electronics that require a durable 3.00mm through hole wafer connector with polarized mating support.
Based on the drawing, this 90 degree wafer connector is a dual row wafer in the DW-WF series with 3.00mm pitch, right angle 90° orientation, and pin options from 2x1P to 2x12P. The recommended PCB layouts are shown for 2x1P, 2x2P, 2x3P, and 2×4~2x12P versions, with Ø1.02±0.05mm terminal holes and Ø3.00±0.05mm locating holes. The drawing also shows PIN 0.64 SQ, overall side height around 11.88mm, mating profile height 9.90mm, and body depth 7.36mm. This 3.00mm dual row connector is built for secure board mounting and easy harness connection in compact right angle layouts.
PE bag and TP tray packing options, which makes this PCB mount wafer connector a flexible choice for different assembly and packing requirements. As a 3.00mm wire to board wafer, it provides a dependable solution for applications needing polarized connection, dual-row contact arrangement, and stable through-hole PCB installation.
| General | |||
| Status | Active | Category | Wafer |
| Product Name | Wafer Connector | Description | 3.00mm Pitch 90° Wafer, DIP |
| Part Number | DW-WF-230082WRnP-XXXX-01 | Component Type | Wafer (DIP) |
| Electrical | |||
| Field | Value | Field | Value |
| Current – Maximum | 5.0 A AC/DC | Voltage – Maximum | 250 V AC/DC |
| Insulation Resistance Min. | 1000 M ohm Min. | Withstanding Voltage | 1500 V AC For One Minute |
| Contact Resistance | 10 m ohm Max. | ||
| Physical | |||
| Circuits (Loaded) | 2x1P to 2x12P | Circuits (maximum) | 2x12P |
| Color – Resin | Black | Durability (mating cycles max) | N/A |
| Glow-Wire Capable | N/A | Lock to Mating Part | Yes |
| Mated Height | 9.90 mm | Mated Width | Per table: 01=6.65 mm; 02=9.65 mm; 03=12.65 mm; 04=15.65 mm; 05=18.65 mm; 06=21.65 mm; 07=24.65 mm; 08=27.65 mm; 09=30.65 mm; 10=33.65 mm; 11=36.65 mm; 12=39.65 mm |
| Material – Metal | Brass | Material – Plating | Per code: 01 Gold Flash / 03 3u Gold / 06 6u Gold / 15 15u Gold / 30 30u Gold / 31 Sn / 32 Ni |
| Material – Plating Thickness | N/A | Net Weight | N/A |
| Material – Resin | PA66 | Material – Shell | N/A |
| Number of Rows | Dual Row | Orientation | Right Angle (90°) |
| Packaging Type | Per code: PE Bag / TP: Tray Packing | PCB Locator | Yes |
| PCB Retention | N/A | Pitch – Mating Interface | 3.00 mm |
| Pitch – Termination | 3.00 mm | Plating min – Mating | N/A |
| Polarized to Mating Part | Yes | Polarized to PCB | Yes |
| Temperature Range | -40 °C to +105 °C | Termination Interface | Through Hole |
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