he 1.42mm Push-Push Micro SIM Card Connector DW-SM-71425-01TR-01 is a low-profile SMT Micro SIM socket with push-push card operation and integrated card detection. It features a 0.5 A / 30 V rating, copper-alloy terminals, stainless-steel shell, gold-flash mating contacts, tape-and-reel packaging, and RoHS-compliant construction.
Applications: Cellular communication equipment, wireless routers, IoT devices, embedded systems, access-control equipment, communication terminals, portable electronics and Micro SIM card interfaces.
Highlights: 1.42 mm low-profile design; Micro SIM card interface; push-push insertion/ejection; SMT termination; integrated card-detect switch; VCC/RST/CLK/GND/VPP/I/O signal contacts; 0.5 A current rating; 30 V rated voltage; ≥1000 MΩ insulation resistance; ≤100 mΩ contact resistance; 500 VDC/1 minute withstand voltage; -40°C to +75°C operating range; high-temperature thermoplastic housing; copper-alloy terminals; stainless-steel shell; gold-flash mating-area plating; tape-and-reel packaging; RoHS compliant.
1.42mm Push-Push Micro SIM Card Connector DW-SM-71425-01TR-01 is a low-profile surface-mount card socket designed for Micro SIM applications requiring compact PCB space, push-push card operation, and integrated card detection. The Dragon Well drawing identifies a 1.42 mm profile, SMT termination, tape-and-reel packaging, and a card-detect switch for reliable insertion status detection.
The connector is rated at 30 V and 0.5 A. Electrical performance includes 1000 MΩ minimum insulation resistance, 100 mΩ maximum contact resistance, and 500 VDC withstand voltage for 1 minute. The specified operating temperature range is -40°C to +75°C, with maximum operating humidity of 80% RH.
This 1.42mm Push-Push Micro SIM Card Connector uses a high-temperature thermoplastic housing, copper-alloy terminals, and a stainless-steel shell. The terminals have a 50 µin nickel underplate, with gold-flash plating specified on the contact and solder areas. For model DW-SM-71425-01TR-01, plating code 01 identifies gold-flash plating on the mating area.
The electrical assignment includes VCC, RST, CLK, GND, VPP and I/O, together with SW1 and SW2 card-detect switch connections. The drawing shows the detect circuit as normally short and changing state when the card is inserted.
The 1.42mm Push-Push Micro SIM Card Connector is suitable for cellular communication equipment, wireless modules, routers, IoT equipment, embedded systems, access-control devices, portable electronics and other products requiring removable Micro SIM connectivity. The terminology is consistent with Amphenol’s 1.42 mm-height, surface-mount, push-push Micro SIM connector with card detection.
| General | |||
| Status | Active | Category | SIM card connector |
| Model No. / Series | DW-SM-71425-XXTR-01 | Description | Push-Push Micro-SIM card connector, 6 SIM contacts + 2 card-detect switch terminals, SMT type, approx. 1.42 mm profile, RoHS compliant |
| Comments | RoHS compliant; XX = connector plating code; TR = Tape Reel | Product Name | Push-Push Micro-SIM Connector |
| Style | Push-Push SMT socket | UPC | N/A |
| Electrical | |||
| Current – Maximum per Contact | 0.5 A | Voltage – Maximum | 30 V |
| Shielded | Yes — stainless steel shell | Grounding to Panel | N/A |
| Contact Resistance (Max) | 100 mΩ Max. | Insulation Resistance (Min) | 1000 MΩ Min. |
| Withstand Voltage | 500 V DC for 1 minute | ||
| Physical | |||
| Card Detection Switch | Yes | Card Entry Location | N/A |
| Circuits (Loaded) | 6 SIM contacts + 2 card-detect switch terminals | Circuits (Maximum) | 8 |
| Pin Assignment | C1=VCC; C2=RST; C3=CLK; C5=GND; C6=VPP; C7=I/O; SW1=Detect Lever/GND; SW2=Detect Switch | ||
| Color – Resin | N/A | Durability (Mating Cycles Max) | N/A |
| Ejector Button Side | N/A | Material – Contact | Copper Alloy |
| Material – Plating Mating | 50 µin Ni underplated overall; Gold Flash plated on contact area; XX code selects mating-area gold finish | Material – Plating Termination | 50 µin Ni underplated overall; Gold Flash plated on solder area |
| Material – Resin | High-temperature thermoplastic | Material – Shell | Stainless Steel |
| Shell Plating | 50 µin Ni underplated overall; Gold Flash plated on contact and solder areas | Packaging Type | Tape Reel (TR) |
| PCB Locator | N/A | PCB Retention | Yes — SMT shell / hold-down solder tabs |
| Pitch – Mating Interface | N/A | Pitch – Termination Interface | N/A |
| Temperature Range – Operating | -40 °C to +75 °C; Humidity 80% R.H. Max. | Termination Interface Style | Surface Mount (SMT) |
| Salt Spray | N/A | Contact Normal Force | N/A |
| Shell Lock / Open Force | N/A | ||
| Overall Length | 16.67 mm | Overall Width | 15.50 mm |
| Overall Height / Profile | 1.43 mm drawing dimension; title specifies 1.42H | Net Weight | N/A |
| Solder Process Data | |||
| Max-Duration | N/A | Max-Cycle | N/A |
| Lead-Free Process Capability | RoHS compliant | Max-Temp | 250°C ±5°C |
