3.0mm pitch 90° wafer DIP connector with dual row structure, 2×1P–2×12P pin options, right-angle through-hole mounting, brass/tin-plated pins, PA46 black housing, 5.0A current rating, 250V AC/DC voltage rating, and RoHS compliance.
• Applications: Wire-to-board connection, PCB signal connection, power connection, industrial control boards, consumer electronics, communication equipment, automation modules, power supply boards, instrumentation, and through-hole PCB assembly.
• Highlights: 3.0mm pitch 90° wafer DIP connector; dual row structure; right-angle 90° orientation; through-hole / DIP mounting; 2×1P–2×12P pin options; 0.64 SQ brass/tin-plated pins; 5.0A AC/DC current rating; 250V AC/DC voltage rating; 1500V AC withstanding voltage for one minute; 1000MΩ min insulation resistance; 10mΩ max contact resistance; black PA46 housing; Ø1.02±0.05mm pin hole; Ø3.00±0.05mm locating hole; 3.20mm pin length; 7.36mm body width; 9.90mm body height; 11.88mm overall height; PE bag or tray packing; RoHS compliant.
3.0mm pitch 90° wafer DIP connector DW-WF-230082WRnP-XXXX-01 is a right-angle through-hole wafer connector designed for wire-to-board and board-level signal connection applications. Based on the drawing title, this product is a 3.0mm pitch 90° wafer DIP connector with dual row structure, right-angle orientation, and through-hole mounting.
This 3.0mm pitch 90° wafer DIP connector supports variable pin options from 2×1P to 2×12P. The connector uses 0.64 SQ brass/tin-plated pins for stable PCB soldering and reliable electrical connection. It supports a 5.0A AC/DC current rating and 250V AC/DC voltage rating, making it suitable for power and signal transfer in compact electronic assemblies.The electrical performance includes 10mΩ maximum contact resistance, 1000MΩ minimum insulation resistance, and 1500V AC withstanding voltage for one minute. The housing material is black PA46, and the operating temperature range is -40°C to +105°C. The drawing confirms 3.00mm pitch, Ø1.02±0.05mm pin holes, Ø3.00±0.05mm locating holes, 3.20mm pin length, 7.36mm body width, 9.90mm body height, and 11.88mm overall height.
The part number supports connector plating options including 01 Gold Flash, 03 3u” Gold, 06 6u” Gold, 15 15u” Gold, 30 30u” Gold, 31 Sn, and 32 Ni. Packaging options include PE bag and tray packing. With RoHS compliance and through-hole DIP mounting, this 3.0mm pitch 90° wafer DIP connector is suitable for reliable PCB assembly in wire-to-board electronic applications.
| General | |||
| Status | Active | Category | Wire-to-Board Connector |
| Model No. | DW-WF-230082WRnP-XXXX-01 | Description | 3.00 mm pitch DIP right-angle dual-row wafer header, through-hole, RoHS compliant |
| Component Type | Header | Product Name | Wafer Connector |
| Mounting Type | Through Hole / DIP | Orientation | Right Angle / 90° |
| Electrical | |||
| Current Rating | 5.0 A AC/DC | Voltage Rating | 250 V AC/DC |
| Temperature Range | -40°C to +105°C | Contact Resistance | 10 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. | Withstanding Voltage | 1500 V AC / One Minute |
| Housing Material | PA46, Black | Contact Material | Brass / Tin-Plated |
| Physical | |||
| Number of Pins | Variable, 2×1P–2×12P | Pitch | 3.00 mm |
| Number of Rows | Dual Row | Connector Style | DIP Wafer |
| Dimension A | Variable, see dimension table below | Dimension B | Variable, see dimension table below |
| Body Height | 9.90 mm | Overall Height | 11.88 mm |
| Side Height | 6.85 mm | Front Projection | 3.20 mm |
| Pin Length | 3.20 mm | Body Width | 7.36 mm |
| PCB Hole Diameter | Ø1.02 ±0.05 mm pin hole; Ø3.00 ±0.05 mm locating hole | Pin Width | 0.64 mm SQ |
| Plating Code | 31 / XX | Plating Finish | Tin Plated / Sn |
| Packaging Code | PE / TP | Packaging | PE Bag / Tray Packing |
