2.00 pitch SMT 90° single row wafer connector with 02P–12P and 16P options, 2.0A/250V AC/DC rating, brass contacts, Nylon66 UL94V-0 housing, right-angle SMT mounting, PE bag packaging, and RoHS compliance.
• Applications: Wire-to-board connection, PCB signal connection, power connection, consumer electronics, communication equipment, industrial control boards, automation modules, power supply boards, instrumentation, and SMT PCB assembly.
• Highlights: 2.00 pitch SMT 90° single row wafer; right-angle 90° orientation; surface mount termination; single row structure; 02P–12P and 16P options; 2.00mm pitch; brass contacts; 2.0A AC/DC current rating; 250V AC/DC voltage rating; 800V AC withstanding voltage per minute; 1000MΩ min insulation resistance; 20mΩ max contact resistance; Nylon66 UL94V-0 housing; 4.70±0.25mm front projection; 3.40±0.20mm pin length; 6.10±0.25mm body height for Type 1; 6.45±0.20mm overall height; Ø0.80 +0.10/-0.00mm recommended PCB hole; PE bag packaging; RoHS compliant.
2.00 pitch SMT 90° single row wafer DW-WF-1200221WRNP-XXPE-XX is a right-angle surface mount wafer connector designed for compact wire-to-board PCB connection applications. Based on the drawing title, this product is a 2.00 pitch SMT 90° single row wafer with right-angle orientation, surface mount termination, and PE bag packaging.
This 2.00 pitch SMT 90° single row wafer supports variable port options from 02P to 12P, with 16P also shown in the dimension table. The connector is designed with 2.00mm pitch spacing and a single row structure, making it suitable for compact PCB layouts where a side-entry wire-to-board connection is required. The drawing confirms 4.70±0.25mm front projection, 3.40±0.20mm pin length, 6.10±0.25mm body height for Type 1, 6.45±0.20mm overall height, and Ø0.80 +0.10/-0.00mm recommended PCB hole.
The electrical specifications include 2.0A AC/DC current rating, 250V AC/DC voltage rating, 20mΩ maximum contact resistance, 1000MΩ minimum insulation resistance, and 800V AC withstanding voltage per minute. The operating temperature range is -25°C to +85°C.
The housing material is Nylon66, UL94V-0, and the contact material is brass. The part number supports plating options including 01 Gold Flash, 03 3u” Gold, 06 6u” Gold, 15 15u” Gold, 30 30u” Gold, 31 Sn, and 32 Ni. With RoHS compliance and surface mount design, this 2.00 pitch SMT 90° single row wafer is suitable for reliable wire-to-board PCB assembly.
| General | |||
| Status | Active | Category | Wire-to-Board Connector |
| Model No. | DW-WF-1200221WRNP-XXPE-XX | Description | 2.00 mm pitch SMT 90° single-row wafer connector, RoHS compliant |
| Component Type | Header | Product Name | Wafer Connector |
| Mounting Type | Surface Mount / SMT | Orientation | Right Angle / 90° |
| Electrical | |||
| Current Rating | 2.0 A AC/DC | Voltage Rating | 250 V AC/DC |
| Temperature Range | -25°C to +85°C | Contact Resistance | 20 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. | Withstanding Voltage | 800 V AC / minute |
| Housing Material | Nylon66, UL94V-0 | Contact Material | Brass |
| Physical | |||
| Number of Pins | Variable, 02P–12P and 16P | Pitch | 2.00 mm |
| Number of Rows | Single Row | Connector Style | SMT Wafer |
| Dimension A | Variable, see dimension table below | Dimension B | Variable, see dimension table below |
| Body Height | 6.10 ± 0.25 mm | Overall Height | 6.45 ± 0.20 mm |
| Side Height | Type 1: 6.10 ± 0.25 mm; Type 2: 0.80 +0.20 / -0 mm terminal offset shown | Front Projection | 4.70 ± 0.25 mm |
| Pin Length | 3.40 ± 0.20 mm | Body Width | Not specified in drawing |
| PCB Hole Diameter | Ø0.80 +0.10 / -0.00 mm | Pin Width | 0.50 ± 0.05 mm |
| Plating Code | XX, variable plating code | Plating Finish | Gold Flash / 3u” Gold / 6u” Gold / 15u” Gold / 30u” Gold / Sn / Ni |
| Packaging Code | PE | Packaging | PE Bag |
