The USB 3.0 Type-A THT receptacle DW-MU30-DA906-01TP-03-2 is a single-port, right-angle female PCB connector with nine signal contacts, a blue LCP housing and a shielded SUS 201 shell. It features gold-flash mating contacts, tin-plated solder areas, through-hole PCB mounting, a 1.5 A rating and 5,000-cycle durability.
USB 3.0 Type-A THT receptacle DW-MU30-DA906-01TP-03-2 is a single-port, nine-contact female USB connector designed for horizontal printed circuit board mounting. The drawing identifies a 90-degree Type-A interface with through-hole signal terminals and through-hole shield retention legs for secure mechanical attachment to the PCB.
This configuration uses a blue LCP high-temperature housing, bronze contacts and a SUS 201 stainless-steel shell. The selected 01 plating option specifies gold flash on the contact area, with a minimum 50 µin nickel underplate and a minimum 100 µin tin finish on the solder area. The shell has a minimum 50 µin nickel finish. The TP option specifies tray packaging, while series code 2 sets drawing dimension A at 2.5 mm.
The nine-contact arrangement includes VBUS, D−, D+, GND, two SuperSpeed receive contacts, drain ground and two SuperSpeed transmit contacts. According to the drawing, the connector has a current rating of 1.5 A, maximum contact resistance of 30 mΩ, minimum insulation resistance of 100 MΩ and dielectric withstand voltage of 100 V RMS.
The USB 3.0 Type-A THT receptacle operates from −40°C to +85°C and has a specified storage temperature range of −25°C to +85°C. Mechanical performance includes a maximum mating force of 35 N, a minimum initial unmating force of 10 N and a minimum unmating force of 8 N after testing. Durability is specified at 5,000 mating cycles.The connector measures 16.70 mm in overall body length, 14.50 mm in overall width and 7.00 mm in maximum body height. Its shielded body, PCB retention features and right-angle orientation make this USB 3.0 Type-A THT receptacle suitable for equipment requiring a conventional USB Type-A interface positioned along the edge of a circuit board.
| General | |||
| Status | Active | Category | USB Connector |
| Model No. | DW-MU30-DA906-XXTP-XX-X | Description | USB 3.0 Type-A female single-port connector, right-angle 90°, through-hole/DIP mounting, 15.60mm width, 4.10mm contact height, 16.70mm body length |
| Component Type | Receptacle | Product Name | USB 3.0 Type-A Female Connector |
| RoHS | Compliant | Packaging | TP: Tray Packing |
| Electrical | |||
| Current Rating | 1.5A | Voltage Rating | N/A |
| Contact Resistance | 30mΩ Max. | Insulation Resistance | 100MΩ Min. |
| Dielectric Withstanding Voltage | 100V RMS | Operating Temperature | -40°C to +85°C |
| Reflow Capability | N/A | Electrical Specification | Available |
| Physical | |||
| Number of Contacts | 9 | Port Type | USB 3.0 Type-A Female |
| Number of Ports | 1 | Mounting Type | Right Angle, Through-Hole / DIP |
| Overall Height | 7.00mm | Overall Width | 15.60mm |
| Front Width | 14.50mm | Body Length | 16.70mm |
| Front Opening Height | 5.12±0.10mm | Recommended Panel Cutout | N/A |
| Insulating Housing & Cover | High-Temperature Plastic; 01: PBT / 02: PA9T / 03: LCP | Housing Color | Blue |
| Contacts 5PIN Material | Bronze | Contacts 4PIN Material | Bronze |
| Shell Material | SUS 201 | Isolated Material | N/A |
| Contact Finish | 1–30µin Gold on Contact Area | Solder Tail Finish | 100µin Min. Tin |
| Underplating | 50µin Min. Nickel All Over | Shell Finish | 50µin Min. Nickel All Over |
| Isolated Finish | N/A | Contact Pitch | 2.00mm PCB Terminal Pitch; Terminal Width 0.40±0.05mm |
| Terminal Plating Options | 01: Gold Flash; 03: 3µin Gold; 06: 6µin Gold; 15: 15µin Gold; 30: 30µin Gold; 31: Sn; 32: Ni | Series | 1: DIM A 2.1mm / 2: DIM A 2.5mm |
| Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ 260°C | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| Package Classification Reflow Temperature (TC) | |||
| Properties | Volume mm³ <350 | Volume mm³ 350–2000 | Volume mm³ >2000 |
| PB-Free Assembly — Package Thickness <1.6mm | 260°C | 260°C | 250°C |
| PB-Free Assembly — Package Thickness 1.6–2.5mm | 260°C | 250°C | 245°C |
