The 3.00mm 14 Pin SMT Wafer Connector is a 2 × 7 dual-row, 90° right-angle PCB header with 3.00 mm pitch, SMT contact termination and press-fit board retention. It is rated at 5 A / 250 V AC/DC and features tin-plated brass contacts, brass press-fit components, LCP UL 94V-0 insulation, and RoHS-compliant construction.
Applications: Wire-to-board PCB connections, industrial control equipment, home appliances, embedded electronics, communication equipment, consumer electronics, power/control interfaces, and compact electronic assemblies.
Highlights: 3.00 mm pitch; 14 pins; 2 × 7 dual-row configuration; 90° right-angle orientation; SMT contact termination; press-fit PCB retention; 5 A AC/DC current rating; 250 V AC/DC voltage rating; ≤10 mΩ contact resistance; ≥1000 MΩ insulation resistance; 800 V AC/1 minute withstand voltage; -25°C to +85°C operating range; brass contacts; brass press-fit components; Sn/tin plating; LCP UL 94V-0 insulation; Ø2.41 ±0.05 mm press-fit PCB holes; RoHS compliant.
3.00mm 14 Pin SMT Wafer Connector DW-WF-230061WR14P-31TP-01 is a dual-row, 90° right-angle PCB header designed for compact wire-to-board interconnection. The Dragon Well drawing confirms a 3.00 mm pitch, 14 total contacts arranged in a 2 × 7 configuration, surface-mount contact termination, and press-fit PCB retention features.
The connector is rated at 5 A AC/DC and 250 V AC/DC. Electrical performance includes 10 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 800 V AC withstand voltage for one minute. Its specified operating temperature range is -25°C to +85°C.
This 3.00mm 14 Pin SMT Wafer Connector uses brass contacts and brass press-fit components. The insulation material is LCP rated UL 94V-0. For this specific product, plating code 31 identifies Sn/tin plating, which is also consistent with the drawing’s material specification.
The recommended PCB layout combines SMT solder pads with Ø2.41 ±0.05 mm press-fit mounting holes, providing electrical termination together with mechanical board retention. The right-angle design positions the mating interface parallel to the PCB, making it useful where vertical clearance is limited.
The 3.00mm 14 Pin SMT Wafer Connector is suitable for industrial controls, home appliances, embedded systems, communication equipment, consumer electronics, power and signal interfaces, and other PCB wire-to-board applications. Comparable Molex 3.00 mm connector families also use dual-row, right-angle and press-fit-retention architectures for wire-to-board PCB headers.
| General | |||
| Status | Active | Category | Wire-to-Board Connector |
| Model No. | DW-WF-230061WRnP-31XX-01 | Description | 3.00 mm pitch SMT dual-row 90° wafer connector with press-fit retention, RoHS compliant |
| Component Type | Header | Product Name | Wafer Connector |
| Mounting Type | Surface Mount / SMT with press-fit retention | Orientation | Right Angle / 90° |
| Electrical | |||
| Current Rating | 5 A AC/DC | Voltage Rating | 250 V AC/DC |
| Temperature Range | -25 °C to +85 °C | Contact Resistance | 10 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. | Withstanding Voltage | 800 V AC / minute |
| Housing Material | LCP, UL94V-0 | Contact Material | Brass |
| Physical | |||
| Number of Pins | 2–12 positions per row, dual row (4–24 contacts total); drawing specification states Circuits: 2–24 | Pitch | 3.00 mm |
| Number of Rows | Dual Row (2) | Connector Style | SMT Dual Row 90° Wafer with Press-Fit |
| Dimension A | Variable by positions per row: 3.00–33.00 mm | Dimension B | Variable by positions per row: 9.65–39.65 mm |
| Body Height | 7.35 mm | Overall Height | 12.15 mm derived (1.40 + 7.35 + 3.40) |
| Side Height | 1.40 mm upper step | Front Projection | 15.80 ± 0.35 mm overall depth |
| Pin Length | 3.40 ± 0.25 mm press-fit retention pin projection | Body Width | 9.90 mm |
| PCB Hole Diameter | Ø2.41 ± 0.05 mm (press-fit holes) | Pin Width | 0.65 ± 0.05 mm |
| Plating Code | 31 | Plating Finish | Tin plated |
| Packaging Code | XX (TR / TB selectable) | Packaging | TR: Tape Reel / TB: Tube package |
