3.00mm 180° Dual Row DIP Wafer Connector

3.00mm 180° dual row DIP wafer connector is a vertical wire-to-board connector designed for reliable PCB through-hole mounting in power and signal applications. Based on the drawing, this connector features a 3.00mm pitch, dual-row structure, 180° vertical orientation, and DIP termination, making it suitable for PCB assemblies that require stable board retention, higher circuit density, and dependable wire-to-board connection.

The product model is DW-WF-2300201WVnP-XXXX-XX. The part number structure identifies this product as a Dragon Well wafer connector series with dual-row layout, 3.00mm pitch, WV vertical 180° orientation, variable total pins, selectable plating code, selectable packaging code, and type options including Type 1, Type 2, and Type 3. The drawing dimension table supports pin options from 02P to 24P, allowing engineers to choose the correct circuit count based on PCB layout and application needs.This 3.00mm 180° dual row DIP wafer connector uses brass terminals with tin over nickel plating for stable conductivity and reliable soldering performance. The insulator material is Nylon 66, UL94V-0, providing flame-retardant protection and mechanical stability for electronic assemblies. Key drawing dimensions include 7.36 ±0.35mm body width, 9.90 ±0.35mm body height, 3.20 ±0.35mm pin length, and 0.64 SQ pin width. The recommended PCB layout uses Ø1.02 ±0.05mm terminal holes.Electrical performance includes 5A AC/DC current rating, 250V AC/DC voltage rating, 10mΩ maximum contact resistance, 1000MΩ minimum insulation resistance, and 1500V AC per minute withstanding voltage. With RoHS compliance and PE bag or tray packing options, this connector is suitable for industrial control boards, power modules, home appliances, communication equipment, consumer electronics, and wire harness PCB connection systems.