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3.00mm Right Angle Wafer Connector

The 3.00mm right angle wafer connector DW-WF-230068 is a dual-row SMT PCB header with a 3.00 mm pitch, 90° mating orientation and configurable 2–24 circuit options. It features copper-alloy contacts, tin plating, a black UL94 V-0 high-temperature housing, a 5 A / 250 V AC/DC rating, and compatibility with the drawing-specified WSD C3030HF dual-row mating housing.

Applications

Typical applications include:

  • Wire-to-board PCB interconnection
  • Power and signal connections
  • Industrial control equipment
  • Embedded electronic systems
  • Power supply and distribution boards
  • Communication equipment
  • Consumer electronic assemblies
  • Computing and peripheral equipment
  • Control modules
  • General PCB power interfaces
Product Highlights
  • 3.00 mm pitch
  • Dual-row configuration
  • 90° right-angle orientation
  • SMT / surface-mount PCB termination
  • Configurable 2–24 circuit options
  • Photographed sample appears 14-position
  • 5 A AC/DC current rating
  • 250 V AC/DC voltage rating
  • 10 mΩ maximum contact resistance
  • 1000 MΩ minimum insulation resistance
  • 1500 VAC/minute withstand voltage
  • Copper-alloy contacts
  • Tin-plated contacts for code 31
  • Black high-temperature plastic housing
  • UL94 V-0 housing rating
  • LCP or PA9T housing options
  • 7.37 ±0.25 mm body depth
  • 9.90 ±0.25 mm body height shown
  • Mates with WSD C3030HF dual-row housing per drawing
  • Tape-reel or tube packaging options
  • RoHS compliant
Delivery By 15 August, Saturday
If Ordered before Today
5-Year Warranty
30-Day Returns
30-Day Exchange

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Description

3.00mm right angle wafer connector DW-WF-230068 is a dual-row surface-mount PCB connector designed for compact wire-to-board power and signal interconnection. The supplied Dragon Well engineering drawing confirms a 3.00 mm pitch, 90° right-angle mating interface and SMT PCB termination, allowing the mating connection to be positioned parallel to the PCB.

The DW-WF-230068 family supports even circuit counts from 2 to 24 positions. The photographed sample appears to use a 14-position, 2×7 configuration, while the engineering drawing uses nP to identify selectable total pin count. The connector has a body depth of 7.37 ±0.25 mm and a drawing-specified body height of 9.90 ±0.25 mm.

Electrical specifications for this 3.00mm right angle wafer connector include a 5 A AC/DC current rating, 250 V AC/DC voltage rating, 10 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 1500 VAC/minute withstand voltage.

The contacts are manufactured from copper alloy. The supplied part-number structure contains plating code 31, which identifies tin plating. The housing is black high-temperature plastic rated UL94 V-0, with LCP and PA9T material selections listed in the ordering information.

The drawing specifies mating with the WSD C3030HF dual-row housing series. Tape-and-reel and tube packaging options are available according to the selected ordering code.

This 3.00mm right angle wafer connector is intended for compact wire-to-board PCB connections requiring dual-row density, right-angle mating and surface-mount assembly. Comparable 3.00 mm connector systems from Molex and Amphenol are likewise used for compact power and signal wire-to-board interconnection.

General
Status Active Category Wafer
Product Name Wafer Connector Description 3.00MM PITCH DUAL ROW 90° WAFER R/A SMT TYPE
Part Number DW-WF-230068WRnP-31XX-XX Component Type Wafer (SMT)
Electrical
Current – Maximum 5A AC/DC Voltage – Maximum 250V AC/DC
Insulation Resistance Min. 1000MΩ Min. Withstanding Voltage 1500V AC/minute
Contact Resistance 10mΩ Max.
Physical
Circuits (Loaded) 02P–24P Circuits (maximum) 24
Color – Resin Black Durability (mating cycles max) N/A
Glow-Wire Capable N/A Lock to Mating Part Yes
Mated Height 16.00±0.25 mm Mated Width Per table: 02=6.65 mm; 04=9.65 mm; 06=12.65 mm; 08=15.65 mm; 10=18.65 mm; 12=21.65 mm; 14=24.65 mm; 16=27.65 mm; 18=30.65 mm; 20=33.65 mm; 22=36.65 mm; 24=39.65 mm
Material – Metal Copper Alloy Material – Plating Tin Plated
Material – Plating Thickness Per code: 01 Gold Flash / 03 3u Gold / 06 6u Gold / 15 15u Gold / 30 30u Gold / 31 Sn / 32 Ni Net Weight N/A
Material – Resin High Temp. Plastic, UL94V-0 Material – Shell N/A
Number of Rows 2 (Dual Row) Orientation Right Angle (90°)
Packaging Type TR: Tape Reel / TB: Tube package PCB Locator N/A
PCB Retention N/A Pitch – Mating Interface 3.00 mm
Pitch – Termination 3.00 mm Plating min – Mating N/A
Polarized to Mating Part Yes Polarized to PCB N/A
Temperature Range -85°C to +105°C Termination Interface Surface Mount

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