
The 3.00mm right angle wafer connector DW-WF-230068 is a dual-row SMT PCB header with a 3.00 mm pitch, 90° mating orientation and configurable 2–24 circuit options. It features copper-alloy contacts, tin plating, a black UL94 V-0 high-temperature housing, a 5 A / 250 V AC/DC rating, and compatibility with the drawing-specified WSD C3030HF dual-row mating housing.
Typical applications include:
31
3.00mm right angle wafer connector DW-WF-230068 is a dual-row surface-mount PCB connector designed for compact wire-to-board power and signal interconnection. The supplied Dragon Well engineering drawing confirms a 3.00 mm pitch, 90° right-angle mating interface and SMT PCB termination, allowing the mating connection to be positioned parallel to the PCB.
The DW-WF-230068 family supports even circuit counts from 2 to 24 positions. The photographed sample appears to use a 14-position, 2×7 configuration, while the engineering drawing uses nP to identify selectable total pin count. The connector has a body depth of 7.37 ±0.25 mm and a drawing-specified body height of 9.90 ±0.25 mm.
Electrical specifications for this 3.00mm right angle wafer connector include a 5 A AC/DC current rating, 250 V AC/DC voltage rating, 10 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 1500 VAC/minute withstand voltage.
The contacts are manufactured from copper alloy. The supplied part-number structure contains plating code 31, which identifies tin plating. The housing is black high-temperature plastic rated UL94 V-0, with LCP and PA9T material selections listed in the ordering information.
The drawing specifies mating with the WSD C3030HF dual-row housing series. Tape-and-reel and tube packaging options are available according to the selected ordering code.
This 3.00mm right angle wafer connector is intended for compact wire-to-board PCB connections requiring dual-row density, right-angle mating and surface-mount assembly. Comparable 3.00 mm connector systems from Molex and Amphenol are likewise used for compact power and signal wire-to-board interconnection.
| General | |||
| Status | Active | Category | Wafer |
| Product Name | Wafer Connector | Description | 3.00MM PITCH DUAL ROW 90° WAFER R/A SMT TYPE |
| Part Number | DW-WF-230068WRnP-31XX-XX | Component Type | Wafer (SMT) |
| Electrical | |||
| Current – Maximum | 5A AC/DC | Voltage – Maximum | 250V AC/DC |
| Insulation Resistance Min. | 1000MΩ Min. | Withstanding Voltage | 1500V AC/minute |
| Contact Resistance | 10mΩ Max. | ||
| Physical | |||
| Circuits (Loaded) | 02P–24P | Circuits (maximum) | 24 |
| Color – Resin | Black | Durability (mating cycles max) | N/A |
| Glow-Wire Capable | N/A | Lock to Mating Part | Yes |
| Mated Height | 16.00±0.25 mm | Mated Width | Per table: 02=6.65 mm; 04=9.65 mm; 06=12.65 mm; 08=15.65 mm; 10=18.65 mm; 12=21.65 mm; 14=24.65 mm; 16=27.65 mm; 18=30.65 mm; 20=33.65 mm; 22=36.65 mm; 24=39.65 mm |
| Material – Metal | Copper Alloy | Material – Plating | Tin Plated |
| Material – Plating Thickness | Per code: 01 Gold Flash / 03 3u Gold / 06 6u Gold / 15 15u Gold / 30 30u Gold / 31 Sn / 32 Ni | Net Weight | N/A |
| Material – Resin | High Temp. Plastic, UL94V-0 | Material – Shell | N/A |
| Number of Rows | 2 (Dual Row) | Orientation | Right Angle (90°) |
| Packaging Type | TR: Tape Reel / TB: Tube package | PCB Locator | N/A |
| PCB Retention | N/A | Pitch – Mating Interface | 3.00 mm |
| Pitch – Termination | 3.00 mm | Plating min – Mating | N/A |
| Polarized to Mating Part | Yes | Polarized to PCB | N/A |
| Temperature Range | -85°C to +105°C | Termination Interface | Surface Mount |