1.00 pitch SMT 90° single row wafer connector with 02P–20P pin options, 1.0A/50V AC/DC rating, copper alloy tin-plated contacts, PA6T/LCP UL94V-0 housing, tape reel packaging, and RoHS compliance.
• Applications: Wire-to-board connection, compact PCB signal interface, consumer electronics, communication modules, smart devices, industrial control boards, automation equipment, instrumentation, power control boards, and SMT PCB assembly.
• Highlights: 1.00 pitch SMT 90° single row wafer; right-angle 90° orientation; surface mount termination; single row structure; 02P–20P options; 1.00mm pitch; copper alloy tin-plated contacts; 1.0A AC/DC current rating; 50V AC/DC voltage rating; 500V AC withstanding voltage per minute; 100MΩ min insulation resistance; 20mΩ max contact resistance; PA6T and LCP housing options; natural color; UL94V-0; 5.20mm front projection; 3.00mm body width; 2.90mm body height; 1.36mm terminal projection; tape reel packaging; RoHS compliant.
1.00 pitch SMT 90° single row wafer DW-WF-1100206WRnP-XXTR-02 is a right-angle surface mount wafer connector designed for compact wire-to-board and PCB signal connection applications. Based on the drawing title, this product is a 1.00 pitch SMT 90° single row wafer with surface mount termination, right-angle orientation, and tape reel packaging.
This 1.00 pitch SMT 90° single row wafer supports variable pin options from 02P to 20P. The connector is designed with 1.00mm pitch spacing and is suitable for compact PCB layouts where a low-profile right-angle wire-to-board interface is required. The drawing confirms 5.20mm front projection, 3.00mm body width, 2.90mm body height, 2.20±0.10mm side height, 1.36mm terminal projection, 4.50mm PCB layout width, and 0.70mm minimum pad spacing.
The electrical specifications include 1.0A AC/DC current rating, 50V AC/DC voltage rating, 20mΩ maximum contact resistance, 100MΩ minimum insulation resistance, and 500V AC withstanding voltage per minute. The operating temperature range is -25°C to +85°C, making this connector suitable for general electronic assemblies and compact wire-to-board systems.
The housing material is PA6T and LCP for choice, natural color, UL94V-0. The contact and soldering terminal material is copper alloy with tin plating. Plating options include Gold Flash, 3u” Gold, 6u” Gold, 15u” Gold, 30u” Gold, Sn, and Ni. With RoHS compliance and tape reel packaging, this 1.00 pitch SMT 90° single row wafer is suitable for automated SMT PCB assembly.
| General | |||
| Status | Active | Category | Wire-to-Board Connector |
| Model No. | DW-WF-1100206WRnP-XXTR-02 | Description | 1.00 mm pitch SMT 90° single-row wafer connector, RoHS compliant |
| Component Type | Header | Product Name | Wafer Connector |
| Mounting Type | Surface Mount / SMT | Orientation | Right Angle / 90° |
| Electrical | |||
| Current Rating | 1.0 A AC/DC | Voltage Rating | 50 V AC/DC |
| Temperature Range | -25°C to +85°C | Contact Resistance | 20 mΩ Max. |
| Insulation Resistance | 100 MΩ Min. | Withstanding Voltage | 500 V AC / minute |
| Housing Material | PA6T and LCP for choice, Natural Color, UL94V-0 | Contact Material | Copper Alloy / Tin Plated |
| Physical | |||
| Number of Pins | Variable, 02P–20P | Pitch | 1.00 mm |
| Number of Rows | Single Row | Connector Style | SMT Wafer |
| Dimension A | Variable, see dimension table below | Dimension B | Variable, see dimension table below |
| Body Height | 2.90 mm | Overall Height | 3.67 mm body height + 1.36 mm terminal projection |
| Side Height | 2.20 ±0.10 mm | Front Projection | 5.20 mm |
| Pin Length | 1.36 mm terminal projection | Body Width | 3.00 mm |
| PCB Hole Diameter | N/A — SMT type, no PCB hole specified | Pin Width | Not specified in drawing |
| Plating Code | XX, variable plating code | Plating Finish | Variable; options include Gold Flash, Gold, Sn, Ni |
| Packaging Code | TR | Packaging | Tape Reel |
