The USB 2.0 Type-A Right Angle DIP Receptacle DW-U20-DA4136-XXXX-02 is a shielded 4-contact female USB connector for through-hole PCB mounting. It features ≤30 mΩ contact resistance, ≥1000 MΩ insulation resistance, 500 VAC withstand voltage, copper-alloy contacts, nickel-plated shielding, selectable contact plating, and RoHS-compliant construction.
Applications: USB host ports, embedded systems, industrial control equipment, communication devices, computers, instrumentation, consumer electronics, test equipment, and PCB-mounted USB interfaces.
Highlights: USB 2.0 Type-A female receptacle; 4 contacts; right-angle/horizontal mating; DIP/through-hole mounting; ≤30 mΩ contact resistance; ≥1000 MΩ insulation resistance; 500 VAC/1 minute withstand voltage; ≤3.75 kg mating force; ≥1.02 kg unmating force; ≥0.8 kg terminal retention; copper-alloy terminals; UL 94V-0 thermoplastic housing; SPCC or copper-alloy shell; gold-flash mating area; tin-plated solder area; nickel-plated shell; tray or PE-bag packaging options; RoHS compliant.
USB 2.0 Type-A Right Angle DIP Receptacle DW-U20-DA4136-XXXX-02 is a shielded female USB connector designed for through-hole PCB installation with horizontal mating access. The Dragon Well drawing confirms a standard 4-contact Type-A interface, DIP termination, metal shielding, and PCB retention features for stable board mounting.
Electrical performance includes 30 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 500 VAC dielectric withstand voltage for 1 minute. Mechanical requirements include a 3.75 kg maximum mating force, 1.02 kg minimum unmating force, and 0.8 kg minimum terminal retention force.
The USB 2.0 Type-A Right Angle DIP Receptacle uses a UL 94V-0 thermoplastic housing and copper-alloy terminals. The shell can be manufactured from SPCC or copper alloy, as specified in the drawing. Contact mating areas use gold flash over nickel, solder areas use tin plating over nickel, and the shield uses nickel plating.
The part-number system provides several connector-plating options, including gold flash, 3 µin, 6 µin, 15 µin and 30 µin gold, as well as Sn and Ni. Packaging options include TP tray packing and PE PE-bag packing. The product is marked RoHS compliant.
The USB 2.0 Type-A Right Angle DIP Receptacle is suitable for USB host interfaces in industrial electronics, embedded systems, communication equipment, computers, control boards, instrumentation and consumer electronics. Amphenol also classifies comparable USB 2.0 products as Type-A, right-angle, through-hole, 4-position receptacles, confirming the standard industry terminology used here.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-U20-DA4136-XXXX-02 | Description | USB 2.0 Type-A female receptacle, 4-pin, 180° through-hole / DIP board-mount type |
| Application | USB 2.0 Type-A board interface | Comments | Connector plating code selectable; TP = Tray Packing; PE = PE-Bag Packing; drawing series suffix = 02 |
| Component Type | Receptacle | Product Name | USB Type-A |
| USB Version | USB 2.0 | Type | Type-A Female |
| Keywords | USB Type-A, 4 Pin, Through-Hole, DIP, 180°, Female Receptacle | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | N/A | Grounding to Panel | N/A |
| Shielded | Yes | Shield Type | Nickel-plated metal shell |
| Voltage – Maximum | N/A | Contact Resistance | 30 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. | Dielectric Withstanding Voltage | 500 V AC for 1 minute |
| 3. Physical | |||
| Circuits (Loaded) | 4 | Circuits (Maximum) | 4 |
| Color – Housing | N/A | Durability (Mating Cycles Max) | N/A |
| Flammability | UL94V-0 | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | N/A |
| Material – Contact | Copper Alloy | Plating on soldering area | Sn plating over Nickel |
| Plating on contact area | Gold Flash over Nickel; finish selectable by connector plating code | Material – Housing | Thermoplastics, UL94V-0 |
| Mounting Style | Through-Hole / DIP | Connector Mounting Type | Board Mount |
| Number of Rows | 1 | Net Weight | N/A |
| Packaging Type | TP: Tray Packing / PE: PE-Bag Packing | Orientation | 180° |
| PCB Retention | Yes — 3 shell / retention mounting points shown in PCB layout | Vacuum Pick-up Cap | N/A |
| Polarized to Mating Part | Yes | Temperature Range – Operating | N/A |
| Waterproof / Dustproof | N/A | Number of Mount Legs | 3 |
| Pitch – Termination Interface | 2.00 mm | Ports | 1 |
| Termination Interface Style | Through-Hole | PCB Thickness (Recommended) | N/A |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ TC (see table below) | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| PB-Free Assembly — Package Thickness <1.6 mm | 260°C | Volume mm³ <350 | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | Volume mm³ 350–2000 | 250°C |
| PB-Free Assembly — Package Thickness >2.5 mm | 250°C | Volume mm³ >2000 | 245°C |
