The USB 2.0 Type-A Vertical Receptacle DW-U20-DA4181-01TP-01 is a 4-contact, vertical 180° through-hole USB 2.0 female connector rated at 1.5 A per contact and 30 VDC. It features gold-plated mating contacts, tin-plated solder tails, a nickel-plated copper-alloy shell, tray packaging, and RoHS-compliant construction.
Applications: USB host ports, desktop and industrial computers, USB hubs, embedded systems, industrial control equipment, communication devices, test equipment, consumer electronics, and PCB-mounted USB interfaces.
Highlights: USB 2.0 Type-A female receptacle; 4 contacts; vertical 180° orientation; DIP/through-hole mounting; 1.5 A per contact; 30 VDC rating; ≤30 mΩ contact resistance; ≥1000 MΩ insulation resistance; 500 VAC dielectric withstand; ≤3.57 kgf mating force; ≥1.02 kgf unmating force; ≥1.0 kgf terminal retention; C2680 copper-alloy contacts; gold mating-area plating; tin solder tails; nickel-plated copper-alloy shell; high-temperature thermoplastic housing; tray packaging; RoHS compliant
USB 2.0 Type-A Vertical Receptacle DW-U20-DA4181-01TP-01 is a shielded female USB connector designed for vertical 180° through-hole PCB mounting. The Dragon Well drawing identifies the connector as a USB 2.0 Type-A female receptacle with four contact terminals, a metal shield, vertical board orientation, and tray packaging.
The connector is rated at 1.5 A per contact terminal and 30 VDC. Electrical performance includes 30 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, and 500 VAC dielectric withstand voltage at sea level.
Mechanical specifications for the USB 2.0 Type-A Vertical Receptacle include a maximum mating force of 3.57 kgf, minimum unmating force of 1.02 kgf, and minimum terminal retention force of 1.0 kgf. These characteristics support secure mating and stable PCB installation.
The housing is manufactured from high-temperature thermoplastic. Contact terminals use C2680 copper alloy, while the specific shell-material code 01 identifies a copper-alloy shell. The contacts are finished with gold plating in the mating area and tin on the solder tails. For this specific configuration, plating code 01 specifies gold flash on the mating area, while the shell uses nickel plating. Packaging code TP specifies tray packing.
This USB 2.0 Type-A Vertical Receptacle is suitable for USB host ports, computers, hubs, industrial electronics, embedded equipment, communication devices, control systems, and other PCB-mounted USB interfaces. Amphenol likewise classifies comparable USB 2.0 Type-A products as vertical, DIP/through-hole receptacles, while Samtec offers vertical-entry USB Type-A interfaces using the same industry terminology.
| 1. General | |||
| Status | Active | Category | USB Connector |
| Part number | DW-U20-DA4181-XXXX-XX | Description | USB 2.0 Type-A female receptacle, 4-pin, 180° through-hole / DIP board-mount type |
| Application | USB 2.0 Type-A board interface | Comments | Mate force: 3.57 kgf Max.; Unmate force: 1.02 kgf Min.; Terminal retention: 1.0 kgf Min.; terminal plating and packaging are code-selectable |
| Component Type | Receptacle | Product Name | USB Type-A |
| USB Version | USB 2.0 | Type | Type-A Female |
| Keywords | USB Type-A, 4 Pin, Through-Hole, DIP, 180°, Female Receptacle | Circuit Application | Power & Signal |
| 2. Electrical | |||
| Current – Maximum | 1.5 A / contact terminal | Grounding to Panel | N/A |
| Shielded | Yes | Shield Type | Nickel-plated metal shell |
| Voltage – Maximum | 30 V DC | Contact Resistance | 30 mΩ Max. |
| Insulation Resistance | 1000 MΩ Min. | Dielectric Withstanding Voltage | 500 V AC at sea level |
| 3. Physical | |||
| Circuits (Loaded) | 4 | Circuits (Maximum) | 4 |
| Color – Housing | N/A | Durability (Mating Cycles Max) | N/A |
| Flammability | N/A | Gender | Female / Receptacle |
| Keying to Mating Part | Yes | Lock to Mating Part | N/A |
| Material – Contact | C2680 Copper Alloy | Plating on soldering area | Tin |
| Plating on contact area | Gold | Material – Housing | High-Temperature Thermoplastics |
| Mounting Style | Through-Hole / DIP | Connector Mounting Type | Board Mount |
| Number of Rows | 1 | Net Weight | N/A |
| Packaging Type | TP: Tray Packing / PE: PE Bag (code-dependent) | Orientation | 180° |
| PCB Retention | N/A | Vacuum Pick-up Cap | N/A |
| Polarized to Mating Part | Yes | Temperature Range – Operating | N/A |
| Waterproof / Dustproof | N/A | Number of Mount Legs | N/A |
| Pitch – Termination Interface | 2.00 mm | Ports | 1 |
| Termination Interface Style | Through-Hole | PCB Thickness (Recommended) | N/A |
| 4. Classification Reflow Soldering Profile | |||
| Preheat Temperature Min | Ts(min) = 150°C | Preheat Temperature Max | Ts(max) = 200°C |
| Preheat Time (Ts min to max) | ts = 60–120 seconds | Ramp-up Rate (Ts to Tp) | 3°C/second max. |
| Liquidous Temperature | TL = 217°C | Time Above TL | tL = 60–150 seconds |
| Peak Package Body Temp | Tp ≤ TC (see table below) | Time within 5°C of Tp | tp = 20–30 seconds |
| Ramp-down Rate (Tp to TL) | 6°C/second max. | Time 25°C to Peak Temp | 8 minutes max. |
| 5. Package Classification Reflow Temperature (TC) | |||
| PB-Free Assembly — Package Thickness <1.6 mm | 260°C | Volume mm³ <350 | 260°C |
| PB-Free Assembly — Package Thickness 1.6–2.5 mm | 260°C | Volume mm³ 350–2000 | 250°C |
| PB-Free Assembly — Package Thickness >2.5 mm | 250°C | Volume mm³ >2000 | 245°C |
