The 1.25mm single row DIP wafer connector DW-WF-1125160WVNP-31PE-01 is a 16-position, 1.25 mm pitch through-hole wire-to-board connector rated at 1 A / 125 V AC/DC. It features phosphor-bronze contacts with tin plating, a PA46 UL 94V-0 housing, AWG 28–32 wire compatibility, PE-bag packaging, and RoHS-compliant construction.
Applications: Consumer electronics, communication equipment, embedded control boards, instrumentation, compact wire-to-board assemblies, control interfaces, small electronic devices, and other space-constrained PCB systems.
Highlights: 1.25 mm pitch; single-row design; 16-position model; series supports 2–16 poles; DIP/through-hole termination; 1 A AC/DC current rating; 125 V AC/DC voltage rating; ≤20 mΩ contact resistance; ≥100 MΩ insulation resistance; 250 V AC/1 minute withstand voltage; -25°C to +85°C operating range; AWG 28–32 applicable wire; phosphor-bronze contacts; tin plating; PA46 UL 94V-0 housing; Ø0.50±0.05 mm PCB holes; PE-bag packaging; RoHS compliant.
1.25mm single row DIP wafer connector DW-WF-1125160WVNP-31PE-01 is a compact through-hole wire-to-board PCB header designed for high-density electronic interconnection. The Dragon Well drawing identifies this model as a single-row 1.25 mm pitch wafer connector with 16 positions, while the same series supports 2 to 16 poles. The recommended PCB layout uses 1.25±0.05 mm contact spacing and Ø0.50±0.05 mm PCB holes. The drawing also specifies a 0.30 mm terminal width, 2.4 mm pin tail length, approximately 4.7 mm body height, and 3.45 mm body depth.
Electrical performance is rated at 1 A AC/DC and 125 V AC/DC. The connector has 20 mΩ maximum contact resistance, 100 MΩ minimum insulation resistance, and a withstand voltage of 250 V AC for one minute. Its specified operating temperature range is -25°C to +85°C. The applicable mating wire range is AWG 28 to AWG 32 according to the drawing.
The 1.25mm single row DIP wafer connector uses a PA46 insulator rated UL 94V-0 and phosphor-bronze contacts. For model DW-WF-1125160WVNP-31PE-01, plating code 31 specifies Sn/tin plating, while PE specifies PE-bag packaging. The series also provides alternative connector-plating codes for gold flash, 3 µin, 6 µin, 15 µin, or 30 µin gold, as well as nickel.
This 1.25mm single row DIP wafer connector is suitable for compact wire-to-board connections in consumer electronics, communication equipment, control boards, embedded devices, instrumentation, and other space-conscious PCB assemblies. Molex uses the same established product terminology 1.25 mm pitch, single row, vertical, through-hole PCB header for its PicoBlade connector family.
| General | |||
| Status | Active | Category | Wire-to-Board Connector |
| Model No. | DW-WF-1125160WVNP-31PE-01 | Description | 1.25 mm pitch single-row vertical DIP wafer connector, 02P–16P, tin plated |
| Component Type | Header | Product Name | Wafer Connector |
| Mounting Type | Through Hole / DIP | Orientation | Vertical / Straight |
| RoHS Compliant | Yes | Series | 1 |
| Electrical | |||
| Current Rating | 1 A AC/DC | Voltage Rating | 125 V AC/DC |
| Temperature Range | -25°C to +85°C | Contact Resistance | 20 mΩ Max. |
| Insulation Resistance | 100 MΩ Min. | Withstanding Voltage | 250 V AC / Minute |
| Housing Material | PA46, UL94V-0 | Contact Material | Phosphor Bronze |
| Applicable Wire Size | AWG #28–#32 | Flammability Rating | UL94V-0 |
| Physical | |||
| Number of Pins | 02P–16P | Pitch | 1.25 mm |
| Number of Rows | Single Row | Connector Style | DIP Wafer |
| Dimension A | 4.25–21.75 mm, depending on pin count | Dimension B | 1.25–18.75 mm, depending on pin count |
| Body Height | 4.70 mm | Overall Height | N/A |
| Side Height | N/A | Front Projection | N/A |
| Pin Length | 2.40 mm | Body Width | 3.45 mm |
| PCB Hole Diameter | Ø0.50 ± 0.05 mm | Pin Width | 0.30 mm |
| Plating Code | 31 | Plating Finish | Sn / Tin Plated |
| Packaging Code | PE | Packaging | PE Bag |
